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Constraints on removal of Si3N4 film with conformation-controlled poly(acrylic acid) in shallow-trench isolation chemical–mechanical planarization (STI CMP)

Published online by Cambridge University Press:  31 January 2011

Ye-Hwan Kim ,
Seung-Mi Lee ,
Kee-June Lee ,
Ungyu Paik  and
Jea-Gun Park
Ye-Hwan Kim
Affiliation:
Division of Advanced Materials Science Engineering, Hanyang University, Seoul 133-791, Republic of Korea
Seung-Mi Lee
Affiliation:
Division of Advanced Materials Science Engineering, Hanyang University, Seoul 133-791, Republic of Korea
Kee-June Lee
Affiliation:
Division of Advanced Materials Science Engineering, Hanyang University, Seoul 133-791, Republic of Korea
Ungyu Paik*
Affiliation:
Division of Advanced Materials Science Engineering, Hanyang University, Seoul 133-791, Republic of Korea
Jea-Gun Park*
Affiliation:
Nano-Silicon-On-Insulator (SOI) Process Laboratory, Hanyang University, Seoul 133-791, Republic of Korea
*
a)Address all correspondence to these authors. e-mail: [email protected]
b)Address all correspondence to these authors. e-mail: [email protected]
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Abstract

The effect of changes in poly(acrylic acid) (PAA) conformation on removal of Si3N4 film was investigated. PAA was used as a passivation agent by adsorption on an Si3N4 film in shallow-trench isolation chemical–mechanical planarization (STI CMP). Adsorption behavior of PAA on the Si3N4 film and the conformation transition were determined by adsorption isotherms and force measurements using atomic force microscopy (AFM) as a function of ionic strength. AFM results revealed that, as ionic strength increases, the repulsive force between the negatively charged carboxylate groups along the backbone of PAA is reduced due to counterion screening and to the changes of PAA conformation from a stretched to a coiled configuration. At high ionic strength, the coiled conformation of PAA formed a dense passivation layer on the Si3N4 film, which led to suppression of the removal rate of Si3N4 film from 72 to 61 Å/min in the STI CMP process.

Keywords

CMPPassivationAdsorption
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 1 , January 2008 , pp. 49 - 54
Copyright
Copyright © Materials Research Society 2008

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