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Connectivity and flux pinning improvements in Ag-clad BSCCO-2223 tapes produced by changes in the cooling rate

Published online by Cambridge University Press:  31 January 2011

J. A. Parrell
Affiliation:
Applied Superconductivity Center and Materials Science Program, University of Wisconsin-Madison, 1500 Engineering Drive, Madison, Wisconsin 53706
D. C. Larbalestier
Affiliation:
Applied Superconductivity Center and Materials Science Program, University of Wisconsin-Madison, 1500 Engineering Drive, Madison, Wisconsin 53706
G. N. Riley Jr
Affiliation:
American Superconductor Corporation, Westborough, Massachusetts 01581
Q. Li
Affiliation:
American Superconductor Corporation, Westborough, Massachusetts 01581
W. L. Carter
Affiliation:
American Superconductor Corporation, Westborough, Massachusetts 01581
R. D. Parrella
Affiliation:
American Superconductor Corporation, Westborough, Massachusetts 01581
M. Teplitsky
Affiliation:
American Superconductor Corporation, Westborough, Massachusetts 01581
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Abstract

The rate at which Ag-clad (Bi, Pb)2Sr2Ca2Cu3Ox tapes are cooled from their final reaction heat treatment influences both the intergranular connectivity and intragranular flux pinning strength of the polycrystalline filaments. As the cooling rate from 825 °C to 730 °C in 7.5% O2 was decreased over a range of 5 °C/min to 0.005 °C/min, Jc (77 K, 0 T) increased from ∼8 to ∼24 kA/cm2, and the irreversibility field increased from, ∼120 to, ∼200 mT. The Jc (4.2 K, 0 T) increased in a similar fashion. Cooling slowly also sharpened the critical temperature transition and increased the critical onset temperature from 107 K to 109 K. These improvements in the superconducting properties occurred despite partial decomposition of the (Bi, Pb)2Sr2Ca2Cu3Ox phase into non-superconducting impurity phases during the slow cooling. A microstructural basis for these multiple effects is described.

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Articles
Copyright
Copyright © Materials Research Society 1997

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References

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