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A comparative fatigue study of solder/electroless-nickel and solder/copper interfaces

Published online by Cambridge University Press:  31 January 2011

Pi Lin Liu  and
Jian Ku Shang
Pi Lin Liu
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
Jian Ku Shang
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
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Abstract

The fatigue resistance of the interface between electroless–nickel and the eutectic tin–lead solder alloy was examined in the as-reflowed and aged conditions and compared to fatigue behavior of the copper/solder interface under the same conditions. In the as-reflowed state, the fatigue resistance of the solder/electroless-nickel interface was slightly superior to that of the solder/copper interface. However, after long-term aging, the fatigue resistance of the solder/electroless-nickel interface became far worse in the high crack growth rate regime. Examinations of interfacial microstructures and crack growth mechanisms indicated that the differences in fatigue resistance between the two interfaces were not directly related to the thickness of the intermetallic phase at the interface, as commonly believed, but were due to differences in crack growth mechanisms.

Type
Articles
Information
Journal of Materials Research , Volume 15 , Issue 11 , November 2000 , pp. 2347 - 2355
Copyright
Copyright © Materials Research Society 2000

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