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Cleavage cracking across triple grain boundary junctions in freestanding silicon thin films

Published online by Cambridge University Press:  31 January 2011

J. Chen  and
Y. Qiao
J. Chen
Affiliation:
Department of Structural Engineering, University of California—San Diego, La Jolla, California 92093-0085
Y. Qiao*
Affiliation:
Department of Structural Engineering, University of California—San Diego, La Jolla, California 92093-0085
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

This article is focused on a fractography study of cleavage cracking at triple grain boundary junctions in freestanding silicon thin films. At a triple junction, as the crystallographic orientations of the two grains ahead of the crack are different by only a few degrees, the cleavage front advance becomes quite jerky. The crack first enters the grain of smaller boundary toughness and then turns into the other grain from the lateral direction. Consequently, the overall fracture resistance cannot be analyzed in the framework of line-average theory. The nonuniform characteristic of crack behavior can be attributed to the increase in local stress intensity. A few typical crack front advance modes are identified.

Keywords

FractureFilmGrain boundaries
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 6 , June 2008 , pp. 1647 - 1651
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1Ohring, M.: The Materials Science of Thin Films Academic Press Oxford, UK 1992Google Scholar
2Thompson, C.V.: Structure evolution during processing of polycrystalline films. Ann. Rev. Mater. Sci. 30, 159 2000CrossRefGoogle Scholar
3Kamins, T.I.: Structure and properties of LPCVD silicon films. J. Electrochem. Soc. 127, 686 1980CrossRefGoogle Scholar
4Joubert, P., Sarret, M., Haji, L., Hamedi, L.Loisel, B.: Pressure dependence of in situ boron doped silicon films prepared by low-pressure chemical vapor deposition I. Microstruct. J. Appl. Phys. 66, 4806 1989CrossRefGoogle Scholar
5Srolovitz, D.J.J.: Grain growth phenomena in films—A Monte Carlo approach. Vac. Sci. Technol., A 4, 2925 1986CrossRefGoogle Scholar
6Qiao, Y.Kong, X.: On size effect of cleavage cracking in polycrystalline thin films. Mech. Mater. 39, 746 2007CrossRefGoogle Scholar
7Wang, J.L., Lian, J., Greer, J.R., Nix, W.D.Kim, K.S.: Size effect in contact compression of nano- and micro-scale pyramid structures. Acta Mater. 54, 3973 2006CrossRefGoogle Scholar
8Greer, J.R., Oliver, W.C.Nix, W.D.: Size dependence of mechanical properties of gold at the micro scale in the absence of strain gradients. Acta Mater. 53, 1821 2005CrossRefGoogle Scholar
9Feng, G.Nix, W.D.: Indentation size effect in MgO. Scripta Mater. 51, 599 2004CrossRefGoogle Scholar
10Marian, J.Knap, J.: Breakdown of self-similar hardening behavior in Au nanopillar microplasticity. Int. J. Multiscale Comput. Eng. 5, 287 2007CrossRefGoogle Scholar
11Choi, D.H., Kim, H.Nix, W.D.: Anelasticity and damping of thin aluminum films on silicon substrates. J. MEMS 13, 230 2004CrossRefGoogle Scholar
12Beloulsov, V.V.: Surface ionics: A brief review. J. Euro. Ceramic Soc. 27, 3459 2007CrossRefGoogle Scholar
13Lin, J., Liu, Y.Dean, T.A.: A review on damage mechanisms, models, and calibration methods under various deformation conditions. Int. J. Damage Mech. 14, 299 2005CrossRefGoogle Scholar
14Ovid’ko, I.A.: Review on the fracture processes in nanocrystaline materials. J. Mater. Sci. 42, 1694 2007CrossRefGoogle Scholar
15Crocker, A., Smith, G., Flewitt, P.Moskovic, R.: Grain boundary fracture in the cleavage regime of polycrystalline materials in Proc. 11th European Conf. on Fracture Eng. Mater. Advis. Serv. Warley UK 1996 233Google Scholar
16Qiao, Y.Kong, X.: Cleavage resistance of fine-structured materials. Met. Mater. Inter. 12, 27 2006CrossRefGoogle Scholar
17Qiao, Y.Argon, A.S.: Cleavage crack-growth-resistance of grain boundaries in polycrystalline Fe–2 wt% Si alloy. Mech. Mater. 35, 129 2003CrossRefGoogle Scholar
18Han, A.Qiao, Y.: Controlling infiltration pressure of a nanoporous silica gel via surface treatment. Chem. Lett. (Jpn.) 36, 882 2007CrossRefGoogle Scholar
19Qiao, Y., Pan, E., Chakravarthula, S.S., Han, F., Liang, J.Gudlavalleti, S.: Measurement of mechanical properties of rectal wall. J. Mater. Sci.: Mater. Med. 16, 183 2005Google ScholarPubMed
20Qiao, Y.Argon, A.S.: Cleavage cracking resistance of high angle grain boundaries in Fe–3 wt% Si alloy. Mech. Mater. 35, 313 2003CrossRefGoogle Scholar
21Gally, B.J.Argon, A.S.: Brittle to ductile transitions in the fracture of silicon single crystals by dynamic crack arrest. Philos. Mag. 81, 699 2001CrossRefGoogle Scholar
22Rose, L.R.F.: Toughening due to crack front interaction with a 2nd-phase dispersion. Mech. Mater. 6, 11 1987CrossRefGoogle Scholar
23Gao, H.Rice, J.R.: Application of 3D weight functions. 2. The stress field and energy of a shear dislocation loop at a crack tip. J. Mech. Phys. Solids 37, 155 1989CrossRefGoogle Scholar
24Kong, X.Qiao, Y.: Fracture in ceramic-matrix composites reinforced with strongly bonded metal particles. Mech. Compos. Mater. 41, 205 2005CrossRefGoogle Scholar
25Xu, G., Bower, A.F.Ortiz, M.: The influence of crack trapping on the toughness of fiber reinforced composites. J. Mech. Phys. Solids 46, 1815 1998CrossRefGoogle Scholar