Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Lindroos, S.
Ruuskanen, T.
Ritala, M.
and
Leskelä, M.
2004.
Growth of Cu thin films by the successive ionic layer adsorption and reaction (SILAR) method.
Thin Solid Films,
Vol. 460,
Issue. 1-2,
p.
36.
Törndahl, Tobias
Ottosson, Mikael
and
Carlsson, Jan-Otto
2004.
Growth of copper metal by atomic layer deposition using copper(I) chloride, water and hydrogen as precursors.
Thin Solid Films,
Vol. 458,
Issue. 1-2,
p.
129.
Jones, Charles A.
Zweber, Amy
DeYoung., James P.
McClain, James B.
Carbonell, Ruben
and
DeSimone, Joseph M.
2004.
Applications of “Dry” Processing in the Microelectronics Industry Using Carbon Dioxide.
Critical Reviews in Solid State and Materials Sciences,
Vol. 29,
Issue. 3-4,
p.
97.
Puurunen, Riikka L.
2005.
Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process.
Journal of Applied Physics,
Vol. 97,
Issue. 12,
Jezewski, Christopher
Lanford, W. A.
Wiegand, Christopher J.
Singh, J. P.
Wang, Pei-I
Senkevich, Jay J.
and
Lu, Toh-Ming
2005.
Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces.
Journal of The Electrochemical Society,
Vol. 152,
Issue. 2,
p.
C60.
Törndahl, Tobias
Lu, Jun
Ottosson, Mikael
and
Carlsson, Jan-Otto
2005.
Epitaxy of copper on α-Al2O3(001) by atomic layer deposition.
Journal of Crystal Growth,
Vol. 276,
Issue. 1-2,
p.
102.
Niskanen, Antti
Rahtu, Antti
Sajavaara, Timo
Arstila, Kai
Ritala, Mikko
and
Leskelä, Markku
2005.
Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films.
Journal of The Electrochemical Society,
Vol. 152,
Issue. 1,
p.
G25.
Elam, J.W.
Zinovev, A.
Han, C.Y.
Wang, H.H.
Welp, U.
Hryn, J.N.
and
Pellin, M.J.
2006.
Atomic layer deposition of palladium films on Al2O3 surfaces.
Thin Solid Films,
Vol. 515,
Issue. 4,
p.
1664.
Törndahl, Tobias
Ottosson, Mikael
and
Carlsson, Jan-Otto
2006.
Growth of Copper(I) Nitride by ALD Using Copper(II) Hexafluoroacetylacetonate, Water, and Ammonia as Precursors.
Journal of The Electrochemical Society,
Vol. 153,
Issue. 3,
p.
C146.
Pimanpang, S.
Wang, Pei-I
Ye, Dexian
Juneja, Jasbir S.
Wang, G.-C.
and
Lu, T.-M.
2007.
Enhancement of Cu(hfac)[sub 2] Chemisorption on the Parylene Surface by N[sub 2] Plasma Surface Modification.
Journal of The Electrochemical Society,
Vol. 154,
Issue. 10,
p.
G215.
Niskanen, A.
Hatanpää, T.
Arstila, K.
Leskelä, M.
and
Ritala, M.
2007.
Radical‐Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine‐Adducted Silver Carboxylates.
Chemical Vapor Deposition,
Vol. 13,
Issue. 8,
p.
408.
Chabal, Yves J.
Higashi, Gregg S.
and
Small, Robert J.
2008.
Handbook of Silicon Wafer Cleaning Technology.
p.
523.
Waechtler, Thomas
Oswald, Steffen
Roth, Nina
Jakob, Alexander
Lang, Heinrich
Ecke, Ramona
Schulz, Stefan E.
Gessner, Thomas
Moskvinova, Anastasia
Schulze, Steffen
and
Hietschold, Michael
2009.
Copper Oxide Films Grown by Atomic Layer Deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO[sub 2].
Journal of The Electrochemical Society,
Vol. 156,
Issue. 6,
p.
H453.
Lee, Byoung H.
Hwang, Jae K.
Nam, Jae W.
Lee, Song U.
Kim, Jun T.
Koo, Sang‐M.
Baunemann, A.
Fischer, Roland A.
and
Sung, Myung M.
2009.
Low‐Temperature Atomic Layer Deposition of Copper Metal Thin Films: Self‐Limiting Surface Reaction of Copper Dimethylamino‐2‐propoxide with Diethylzinc.
Angewandte Chemie,
Vol. 121,
Issue. 25,
p.
4606.
Lee, Byoung H.
Hwang, Jae K.
Nam, Jae W.
Lee, Song U.
Kim, Jun T.
Koo, Sang‐M.
Baunemann, A.
Fischer, Roland A.
and
Sung, Myung M.
2009.
Low‐Temperature Atomic Layer Deposition of Copper Metal Thin Films: Self‐Limiting Surface Reaction of Copper Dimethylamino‐2‐propoxide with Diethylzinc.
Angewandte Chemie International Edition,
Vol. 48,
Issue. 25,
p.
4536.
Chu, Schubert S.
2009.
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications.
p.
207.
Wu, L.
and
Eisenbraun, E.
2009.
Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications.
Journal of The Electrochemical Society,
Vol. 156,
Issue. 9,
p.
H734.
George, Steven M.
2010.
Atomic Layer Deposition: An Overview.
Chemical Reviews,
Vol. 110,
Issue. 1,
p.
111.
Lee, Han-Bo-Ram
Kim, Woo-Hee
Lee, Jeong Won
Kim, Jae-Min
Heo, Kwang
Hwang, In Chan
Park, Yongjun
Hong, Seunghun
and
Kim, Hyungjun
2010.
High Quality Area-Selective Atomic Layer Deposition Co Using Ammonia Gas as a Reactant.
Journal of The Electrochemical Society,
Vol. 157,
Issue. 1,
p.
D10.
Dai, Min
Kwon, Jinhee
Halls, Mathew D.
Gordon, Roy G.
and
Chabal, Yves J.
2010.
Surface and Interface Processes during Atomic Layer Deposition of Copper on Silicon Oxide.
Langmuir,
Vol. 26,
Issue. 6,
p.
3911.