Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Chang, Chia‐Ruey
and
Jean, Jau‐Ho
1998.
Effects of Silver‐Paste Formulation on Camber Development during the Cofiring of a Silver‐Based, Low‐Temperature‐Cofired Ceramic Package.
Journal of the American Ceramic Society,
Vol. 81,
Issue. 11,
p.
2805.
Chang, Chia‐Ruey
and
Jean, Jau‐Ho
1999.
Crystallization Kinetics and Mechanism of Low‐Dielectric, Low‐Temperature, Cofirable CaO‐B2O3‐SiO2 Glass‐Ceramics.
Journal of the American Ceramic Society,
Vol. 82,
Issue. 7,
p.
1725.
Jean, Jau‐Ho
Lee, Cheng‐Horng
and
Kou, Wen‐Song
1999.
Effects of Lead(II) Oxide on Processing and Properties of Low‐Temperature‐Cofirable Ni‐Cu‐Zn Ferrite.
Journal of the American Ceramic Society,
Vol. 82,
Issue. 2,
p.
343.
Xu, Z.
Ma, J.
Han, Z.
Wang, Y.
Huang, L.
and
Tang, X.
2000.
Research of thick film copper circuit in microelectronic packaging.
p.
424.
Kanters, Johannes
Eisele, Ulrich
and
Rödel, Jürgen
2001.
Cosintering Simulation and Experimentation: Case Study of Nanocrystalline Zirconia.
Journal of the American Ceramic Society,
Vol. 84,
Issue. 12,
p.
2757.
Wang, Yonggang
Zhang, Guangneng
and
Ma, Jusheng
2002.
Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging.
Materials Science and Engineering: B,
Vol. 94,
Issue. 1,
p.
48.
Zuo, Ruzhong
Li, Longtu
and
Gui, Zhilun
2002.
Effects of BaTiO3 additive on densification mechanism of silver–palladium paste.
Materials Chemistry and Physics,
Vol. 74,
Issue. 2,
p.
182.
Zuo, Ruzhong
Li, Longtu
Gui, Zhilun
Hu, Xiaobing
and
Ji, Chengxiang
2002.
Effects of Additives on the Interfacial Microstructure of Cofired Electrode‐Ceramic Multilayer Systems.
Journal of the American Ceramic Society,
Vol. 85,
Issue. 4,
p.
787.
Hrovat, M.
Holc, J.
Drnovsek, S.
Belavic, D.
Bernard, J.
Kosec, M.
Golonka, L.
Dziedzic, A.
and
Kita, J.
2003.
Ferroelectric thick films on LTCC substrates - preliminary results.
p.
179.
Hrovat, Marko
Belavič, Darko
Benčan, Andreja
Bernard, Janez
Holc, Janez
Cilenšek, Jena
Smetana, Walter
Homolka, Heinz
Reicher, Roland
Golonka, Leszek
Dziedzic, Andrzej
and
Kita, Jaroslaw
2003.
Thick-film resistors on various substrates as sensing elements for strain-gauge applications.
Sensors and Actuators A: Physical,
Vol. 107,
Issue. 3,
p.
261.
Wymyslowski, A.
Santo-Zamik, M.
Friedel, K.
and
Belavic, D.
2004.
Numerical simulation and experimental verification of the piezoresistivity phenomenon for the printed thick-film piezoresistors.
p.
359.
JEONG, SOON-JONG
KOH, JUNG-HYUK
LEE, DONG-YOON
LEE, JAE-SEOK
HA, MUN-SU
SONG, JAE-SUNG
and
KIM, MYOUNG-HO
2004.
EFFECT OF NANOSIZED TiO2 POWDER ON PREPARATION AND PROPERTIES OF Ag-BASED ELECTRODE MATERIALS.
International Journal of Nanoscience,
Vol. 03,
Issue. 06,
p.
829.
Belavič, Darko
Hrovat, Marko
Kita, Jaroslaw
Holc, Janez
Cilenšek, Jena
Golonka, Leszek
and
Dziedzic, Andrzej
2005.
Evaluation of compatibility of thick-film PTC thermistors and LTCC structures.
Microelectronics Reliability,
Vol. 45,
Issue. 12,
p.
1924.
Xie, Rong-Jun
Zuo, Ruzhong
Aulbach, Emil
Mackens, Uwe
Hirosaki, Naoto
and
Rödel, Jürgen
2005.
Uniaxial viscosity of low-temperature cofired ceramic (LTCC) powder compacts determined by loading dilatometry.
Journal of the European Ceramic Society,
Vol. 25,
Issue. 4,
p.
417.
Mohanram, Aravind
Messing, Gary L.
and
Green, David J.
2005.
Densification and Sintering Viscosity of Low‐Temperature Co‐Fired Ceramics.
Journal of the American Ceramic Society,
Vol. 88,
Issue. 10,
p.
2681.
Hrovat, Marko
Belavič, Darko
Kita, Jaroslaw
Cilenšek, Jena
Golonka, Leszek
and
Dziedzic, Andrzej
2005.
Thick-film temperature sensors on alumina and LTCC substrates.
Journal of the European Ceramic Society,
Vol. 25,
Issue. 15,
p.
3443.
Koh, Young‐Hag
Knapp, Angela
Halloran, John W.
Kim, Hae‐Won
and
Kim, Hyoun‐Ee
2005.
Co‐Firing of Spatially Varying Dielectric Ca–Mg–Silicate and Bi–Ba–Nd–Titanate Composite.
Journal of the American Ceramic Society,
Vol. 88,
Issue. 10,
p.
2690.
Wenxia Li
and
Lannutti, J.J.
2005.
Curvature evolution in LTCC tapes and laminates.
IEEE Transactions on Components and Packaging Technologies,
Vol. 28,
Issue. 1,
p.
149.
Hsu, Rung‐Tsung
and
Jean, Jau‐Ho
2005.
Key Factors Controlling Camber Behavior During the Cofiring of Bi‐Layer Ceramic Dielectric Laminates.
Journal of the American Ceramic Society,
Vol. 88,
Issue. 9,
p.
2429.
Chang, Jui‐Chuan
and
Jean, Jau‐Ho
2005.
Camber Development During the Cofiring of Bi‐Layer Glass‐Based Dielectric Laminate.
Journal of the American Ceramic Society,
Vol. 88,
Issue. 5,
p.
1165.