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Brittle fracture of nickel by dynamic indentation

Published online by Cambridge University Press:  31 January 2011

J.W. Hoehn ,
T. Foecke  and
W.W. Gerberich
J.W. Hoehn
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Avenue SE, Minneapolis, Minnesota 55455-0132
T. Foecke*
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Avenue SE, Minneapolis, Minnesota 55455-0132
W.W. Gerberich
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Avenue SE, Minneapolis, Minnesota 55455-0132
*
a)Currently NRC Post-Doctoral Associate, National Institute of Standards and Technology, Gaithersburg, Maryland 20899.
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Abstract

Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 7 , Issue 8 , August 1992 , pp. 1973 - 1975
Copyright
Copyright © Materials Research Society 1992

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References

1.Lynch, S. P., Materials Forum 11, 268 (1988).Google Scholar
2.Lichter, B. D., Flanagan, W. F., Lee, J. B., and Zhu, M., in Environment-Induced-Cracking of Metals, NACE-10, edited by Gangloff, R. and Ives, M. B. (Nat. Assoc. Corros. Engineers, Houston, TX, 1990), p. 251.Google Scholar
3.Sieradzki, K., Kim, J. S., Cole, A. T., and Newman, R. C., J. Electrochem. Soc. 7, 1635 (1987).Google Scholar
4.Rice, J. R. and Thomson, R., Philos. Mag. 29, 73 (1974).CrossRefGoogle Scholar
5.Marsh, P., Zielinski, W., Huang, H., and Gerberich, W. W., Acta Metall. et Mater. (1992, in press).Google Scholar
6.Daw, M. S., Baskes, M. I., Bisson, C. L., and Wolfer, W. G., in Modeling Environmental Effects on Crack Growth Processes, edited by Jones, R. H. and Gerberich, W. W. (TMS, AIME, Warrendale, PA, 1986), p. 99.Google Scholar
7.Nadai, A., Theory of Flow and Fracture of Solids (McGraw-Hill, Inc., New York, 1950), p. 37.Google Scholar
8.Sieradzki, K. and Newman, R. C., Philos. Mag. A51, 95 (1985).CrossRefGoogle Scholar
9.Sieradzki, K. and Newman, R. C., J. Phys. Chem. Solids 48, 1101 (1987).CrossRefGoogle Scholar