Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Pramanick, S.
Brown, D. D.
Pham, V.
Besser, P.
Sanchez, J.
Bui, N.
Hijab, R.
and
Yue, J. T.
1994.
Effect of Mechanical Stress on Electromigration Failure Mode During Accelerated Electromigration Tests.
MRS Proceedings,
Vol. 356,
Issue. ,
Besser, Paul R.
Sanchez, John E.
Brennan, S.
Bravman, John C.
Takaoka, G.
and
Yamada, I.
1994.
Mechanical Behavior of Single Crystal A1 (111) and Bicrystal Al (110) Films on Silicon Substrates.
MRS Proceedings,
Vol. 343,
Issue. ,
Wang, P.-C.
Cargill, G. S.
and
Noyan, I. C.
1994.
Strain Measurements and Laue Diffraction with Microbeams.
MRS Proceedings,
Vol. 375,
Issue. ,
Malhotra, S. G.
Rek, Z. U.
Parfitt, L. J.
Yalisove, S. M.
and
Bilello, J. C.
1994.
Principal Residual Strains as A function of Depth for Sputter Deposited Mo Thin Films.
MRS Proceedings,
Vol. 356,
Issue. ,
Besser, Paul R.
Marieb, Thomas N.
Bravman, John C.
and
Flinnt, Paul A.
1994.
Measurement and Interpretation of Strain Relaxation in Passivated Al-0.5%Cu Lines.
MRS Proceedings,
Vol. 338,
Issue. ,
Shi, L. T.
and
Tu, K. N.
1995.
Finite-element stress analysis of failure mechanisms in a multilevel metallization structure.
Journal of Applied Physics,
Vol. 77,
Issue. 7,
p.
3037.
Malhotra, S. G.
Rek, Z. U.
Yalisove, S. M.
and
Bilello, J. C.
1995.
Depth Dependence of Residual Strains in Textured Mo Thin Films Using High-Resolution X-Ray Diffraction.
MRS Proceedings,
Vol. 403,
Issue. ,
Keller, R.-M.
Kuschke, W.-M.
Kretschmann, A.
Bader, S.
Vinci, R.P.
and
Arzt, E.
1995.
Influence of Film Thickness and Capping Layer on the Mechanical Properties of Copper Films.
MRS Proceedings,
Vol. 391,
Issue. ,
Bochníček, Z.
Holý, V.
Wolf, K.
Stanzl, H.
and
Gebhardt, W.
1995.
High-resolution x-ray diffractometry of ZnTe layers at elevated temperatures.
Journal of Applied Physics,
Vol. 78,
Issue. 2,
p.
862.
Malhotra, S. G.
Rek, Z. U.
Yalisove, S. M.
and
Bilello, J. C.
1996.
Depth dependence of residual strains in polycrystalline Mo thin films using high-resolution x-ray diffraction.
Journal of Applied Physics,
Vol. 79,
Issue. 9,
p.
6872.
Besser, Paul R.
Marieb, Thomas N.
Lee, Jin
Flinn, Paul A.
and
Bravman, John C.
1996.
Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines.
Journal of Materials Research,
Vol. 11,
Issue. 1,
p.
184.
Jain, S. C.
Maes, H. E.
Pinardi, K.
and
De Wolf, I.
1996.
Stresses and strains in lattice-mismatched stripes, quantum wires, quantum dots, and substrates in Si technology.
Journal of Applied Physics,
Vol. 79,
Issue. 11,
p.
8145.
Kuschke, W. -M.
Carstanjen, H. -D.
Pazarkas, N.
Plachke, D. -W.
and
Arzt, E.
1998.
Influence of water absorption by silicate glass on the strains in passivated Al conductor lines.
Journal of Electronic Materials,
Vol. 27,
Issue. 7,
p.
853.
Kraft, O.
and
Nix, W.D.
1998.
Thermomechanical Behavior of Continuous and Patterned Al Thin Films.
MRS Proceedings,
Vol. 516,
Issue. ,
Kraft, O.
and
Nix, W. D.
1998.
Measurement of the lattice thermal expansion coefficients of thin metal films on substrates.
Journal of Applied Physics,
Vol. 83,
Issue. 6,
p.
3035.
Shen, Y-L.
Suresh, S.
He, M. Y.
Bagchi, A.
Kienzle, O.
Rühle, M.
and
Evans, A. G.
1998.
Stress evolution in passivated thin films of Cu on silica substrates.
Journal of Materials Research,
Vol. 13,
Issue. 7,
p.
1928.
Gouldstone, A.
Shen, Y-L.
Suresh, S.
and
Thompson, C. V.
1998.
Evolution of stresses in passivated and unpassivated metal interconnects.
Journal of Materials Research,
Vol. 13,
Issue. 7,
p.
1956.
Hommel, M.
Kraft, O.
and
Arzt, E.
1999.
A new method to study cyclic deformation of thin films in tension and compression.
Journal of Materials Research,
Vol. 14,
Issue. 6,
p.
2373.
Shen, Y.-L.
and
Guo, Y. L.
1999.
Designing test interconnect structures for micro-scale stress measurement: An analytical guidance.
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena,
Vol. 17,
Issue. 2,
p.
448.
Besser, Paul R.
1999.
Mechanical Stress Measurements in Damascene-Fabricated Aluminum Interconnect Lines.
MRS Proceedings,
Vol. 594,
Issue. ,