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An efficient way of extracting creep properties from short-time spherical indentation tests

Published online by Cambridge University Press:  30 October 2015

Felix Rickhey
Affiliation:
Department of Mechanical Engineering, Sogang University, Seoul 121-742, Republic of Korea
Jin Haeng Lee*
Affiliation:
Korea Atomic Energy Research Institute, Daejeon 305-353, Republic of Korea
Hyungyil Lee*
Affiliation:
Department of Mechanical Engineering, Sogang University, Seoul 121-742, Republic of Korea
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Indentation as a means to extract creep properties has the advantage that it can be applied directly to micro/nano-structures. Many studies on indentation creep reported at least partially poor agreement with creep parameters derived from uniaxial test. One important reason for the incompatibility is the neglect of transient creep. Another one is the choice of equivalent stress and strain measures to relate the different material responses. Applying a material model that accounts for transient creep effects we propose an efficient method for deriving creep properties from short-time spherical indentation tests. We first determine a subsurface point where the material response is very close to that observed in uniaxial tests. We then map the load–displacement data to the material response, expressed in terms of two dimensionless variables, at this point. Converting the dimensionless variables data to stress, strain, and strain rate data, we finally determine the material's creep coefficient and exponent.

Type
Articles
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Gu, C.D., Lian, J.S., Jiang, Q., and Zheng, W.T.: Experimental and modelling investigations on strain rate sensitivity of an electrodeposited 20 nm grain sized Ni. J. Phys. D: Appl. Phys. 40, 7440 (2007).CrossRefGoogle Scholar
Yoo, B-G., Oh, J-H., Kim, Y-J., Park, K-W., Lee, J-C., and Jang, J-i.: Nanoindentation analysis of time-dependent deformation in as-cast and annealed Cu–Zr bulk metallic glass. Intermetallics 18, 1898 (2010).Google Scholar
Yoo, B-G., Kim, Y-J., Oh, J-H., Ramamurty, U., and Jang, J-i.: Room temperature creep in amorphous alloys: Influence of initial strain and free volume. Scr. Mater. 63, 1205 (2010).CrossRefGoogle Scholar
Huang, C-C., Wei, M-K., and Lee, S.: Transient and steady-state nanoindentation creep of polymeric materials. Int. J. Plast. 27, 1093 (2011).Google Scholar
Shen, L., Cheong, W.C.D., Foo, Y.F., and Chen, Z.: Nanoindentation creep of tin and aluminum: A comparative study between constant load and constant strain rate methods. Mater. Sci. Eng., A 532, 505 (2012).CrossRefGoogle Scholar
Choi, I-C., Kim, Y-J., Seok, M-J., Yoo, B-G., Kim, J-Y., Wang, Y., and Jang, J-i.: Nanoscale room temperature creep of nanocrystalline nickel pillars at low stress. Int. J. Plast. 41, 53 (2013).CrossRefGoogle Scholar
Bower, A.F., Fleck, N.A., Needleman, A., and Ogbonna, N.: Indentation of a power law creeping solid. Proc. R. Soc. A 441, 97 (1993).Google Scholar
Lucas, B.N. and Oliver, W.C.: Indentation power-law creep of high-purity indium. Metall. Mater. Trans. A 30, 601 (1999).CrossRefGoogle Scholar
Ma, Z.S., Long, S.G., Zhou, Y.C., and Pan, Y.: Indentation scale dependence of tip-in creep behavior in Ni thin films. Scr. Mater. 59, 195 (2008).Google Scholar
Ma, Z., Long, S., and Pan, Y.: Loading rate sensitivity of nanoindentation creep in polycrystalline Ni films. J. Mater. Sci. 43, 5952 (2008).CrossRefGoogle Scholar
Choi, I-C., Yoo, B-G., Kim, Y-J., Seok, M-J., Wang, Y., and Jang, J-i.: Estimating the stress exponent of nanocrystalline nickel: Sharp vs. spherical indentation. Scr. Mater. 65, 300 (2011).CrossRefGoogle Scholar
Wang, C.L., Lai, Y.H., Huang, J.C., and Nieh, T.G.: Creep of nanocrystalline nickel: A direct comparison between uniaxial and nanoindentation creep. Scr. Mater. 60, 175 (2010).Google Scholar
Fujiwara, M. and Otsuka, M.: Indentation creep of β-Sn and Sn-Pb eutectic alloy. Mater. Sci. Eng., A 319321, 929 (2001).Google Scholar
Liu, C.Z. and Chen, J.: Nanoindentation of lead-free solders in microelectronic packaging. Mater. Sci. Eng., A 448, 340 (2007).CrossRefGoogle Scholar
Mahmudi, R., Geranmayeh, A.R., Khanbareh, H., and Jahangin, N.: Indentation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solder alloys. Mater. Des. 30, 574 (2009).CrossRefGoogle Scholar
Mahmudi, R., Pourmajidian, M., Geranmayeh, A.R., Gorgannejad, S., and Hashemizadeh, S.: Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition. Mater. Sci. Eng., A 565, 236 (2013).Google Scholar
Marques, V.M.F., Wunderle, B., Johnston, C., and Grant, P.S.: Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature. Acta Mater. 61, 2471 (2013).Google Scholar
Tagaki, H., Dao, M., Fujiwara, M., and Otsuka, M.: Experimental and computational creep characterization of Al–Mg solid-solution alloy through instrumented indentation. Philos. Mag. 83, 3959 (2003).CrossRefGoogle Scholar
Geranmayeh, A.R. and Mahmudi, R.: Indentation creep of a cast Mg–6Al–1Zn–0.7Si alloy. Mater. Sci. Eng., A 614, 311 (2014).Google Scholar
Chen, W-M., Cheng, Y-T., and Li, M.: Indentation of power-law creep solids by self-similar indenters. Mater. Sci. Eng., A 527, 5613 (2010).Google Scholar
Stone, D.S., Jakes, J.E., Puthoff, J., and Elmustafa, A.A.: Analysis of indentation creep. J. Mater. Res. 25, 611 (2010).Google Scholar
Su, C., Herbert, E.G., Sohn, S., LaManna, J.A., Oliver, W.A., and Pharr, G.M.: Measurement of power-law creep parameters by instrumented indentation methods. J. Mech. Phys. Solids 61, 517 (2013).Google Scholar
Dean, J., Campbell, J., Aldrich-Smith, G., and Clyne, T.W.: A critical assessment of the “stable indenter velocity” method for obtaining the creep stress exponent from indentation data. Acta Mater. 80, 56 (2014).Google Scholar
Cordova, M.E. and Shen, Y-L.: Indentation versus uniaxial power-law creep: A numerical assessment. J. Mater. Sci. 50, 1394 (2015).Google Scholar
Ma, Z.S., Zhou, Y.C., Long, S.G., and Lu, C.: Characterization of stress-strain relationships of elastoplastic materials: An improved method with conical and pyramidal indenters. Mech. Mater. 54, 113 (2012).CrossRefGoogle Scholar
Takagi, H. and Fujiwara, M.: Set of conversion coefficients for extracting uniaxial creep data from pseudo-steady indentation creep test results. Mater. Sci. Eng., A 602, 98 (2014).Google Scholar
Ogbonna, N., Fleck, N.A., and Cocks, C.F.: Transient creep analysis of ball indentation. Int. J. Mech. Sci. 37, 1179 (1995).CrossRefGoogle Scholar
Goodall, R. and Clyne, T.W.: A critical appraisal of the extraction of creep parameters from nanoindentation data obtained at room temperature. Acta Mater. 54, 5489 (2006).CrossRefGoogle Scholar
Wang, C.L., Yhang, M., and Nieh, T.G.: Nanoindentation creep of nanocrystalline nickel at elevated temperatures. J. Phys. D: Appl. Phys. 42, 1 (2009).Google Scholar
Dean, J., Bradbury, A., Aldrich-Smith, G., and Clyne, T.W.: A procedure for extracting primary and secondary creep parameters from nanoindentation data. Mech. Mater. 65, 124 (2013).Google Scholar
Maier, V., Merle, B., Göken, M., and Durst, K.: An improved long-term nanoindentation creep testing approach for studying the local deformation processes in nanocrystalline metals at room and elevated temperatures. J. Mater. Res. 28, 1177 (2013).CrossRefGoogle Scholar
Abaqus: User's Manual, Version 6.13 (Dassault Systèmes Simulia Corp, Providence, RI, 2013).Google Scholar
Lee, H., Lee, J.H., and Pharr, G.M.: A numerical approach to spherical indentation techniques for material property evaluation. J. Mech. Phys. Solids 53, 2037 (2005).Google Scholar