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Adhesion properties of a structural etch stop material for use in multilayer electronic wiring structures

Published online by Cambridge University Press:  03 March 2011

Ruud A. Haring ,
Sharon L. Nunes ,
Richard P. McGouey ,
Eileen A. Galligan ,
Willi Volksen ,
James L. Hedrick  and
Jeff Labadie
Ruud A. Haring
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Sharon L. Nunes
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Richard P. McGouey
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Eileen A. Galligan
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Willi Volksen
Affiliation:
IBM Research Division, Almaden Research Center, 650 Harry Road, San Jose, California 95120
James L. Hedrick
Affiliation:
IBM Research Division, Almaden Research Center, 650 Harry Road, San Jose, California 95120
Jeff Labadie
Affiliation:
IBM Research Division, Almaden Research Center, 650 Harry Road, San Jose, California 95120

Abstract

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A thermally stable copolymer of a polyimide and a dianiline terminated polydimethylsiloxane has been developed for use as a structural oxygen etch barrier material in high performance multilayer electronic wiring structures. We report on the preparation of the etch barrier material and on investigations of the etch stop and adhesion properties of this material. Studies on the effects of adhesion-promoting plasma treatments are supported by x-ray photoelectron spectroscopy (XPS) and Rutherford backscattering spectrometry (RBS) data. Before plasma treatment, it is observed that the siloxane component segregates to the surface. After either an O2 reactive ion etch treatment or H2O plasma exposure, the unusual XPS charging effects are interpreted as a surface layer containing two distinct phases: the etched polyimide fraction and a partial overlayer of a carbon containing SiO2

Type
Articles
Information
Journal of Materials Research , Volume 10 , Issue 4 , April 1995 , pp. 1028 - 1037
Copyright
Copyright © Materials Research Society 1995

References

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