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The adhesion energy between polymer thin films and self-assembled monolayers

Published online by Cambridge University Press:  31 January 2011

Andrew V. Zhuk ,
Anthony G. Evans ,
John W. Hutchinson  and
George M. Whitesides
Andrew V. Zhuk
Affiliation:
Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
Anthony G. Evans
Affiliation:
Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
John W. Hutchinson
Affiliation:
Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
George M. Whitesides
Affiliation:
Department of Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts 02138
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Extract

A superlayer test has been adapted for the measurement of the fracture energy between epoxy thin films and self-assembled monolayers (SAM's) on Au/Ti/Si substrates. The “arrest” mode of analysis has been shown to provide consistent results, particularly when relatively wide lines are used to encourage lateral decohesions. The fracture energy, Γi, of the interface between the monolayer and the epoxy is varied by adjusting the ratio of COOH/CH3 terminal groups. Connections among Γi, the surface energies, and the inelastic deformations occurring in the epoxy are explored upon comparison with interface crack growth simulations.

Type
Articles
Information
Journal of Materials Research , Volume 13 , Issue 12 , December 1998 , pp. 3555 - 3564
Copyright
Copyright © Materials Research Society 1998

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