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Additive enhanced nonaqueous electrodeposition of silver on Ba2YCu3O7

Published online by Cambridge University Press:  31 January 2011

J. M. Rosamilia  and
B. Miller
J. M. Rosamilia
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974
B. Miller
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974
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Abstract

A nonaqueous plating bath for silver deposition on the Ba2YCu3O7 superconductor has been modified with thiourea to give enhanced coverage of the metal film at low thicknesses. For both porous and high density ceramic substrates, SEM and optical microscopy show nucleation of silver deposits is increased by the additive. The resulting silver-superconductor contact resistances are comparable to those achieved without additives. Adhesion of the deposits and ease of mechanical handling are improved with thiourea. The combination of highly reactive oxidized substrate, nonaqueous solvent, and strongly surface active agent forms a novel extension for electrodeposition science.

Type
Articles
Information
Journal of Materials Research , Volume 5 , Issue 8 , August 1990 , pp. 1612 - 1615
Copyright
Copyright © Materials Research Society 1990

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