Hostname: page-component-cd9895bd7-gxg78 Total loading time: 0 Render date: 2024-12-23T12:05:54.506Z Has data issue: false hasContentIssue false
  • English
  • Français

Accurate measurement of tip–sample contact size during nanoindentation of viscoelastic materials

Published online by Cambridge University Press:  31 January 2011

B. Tang  and
A. H. W. Ngan
B. Tang
Affiliation:
Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong, People's Republic of China
A. H. W. Ngan
Affiliation:
Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong, People's Republic of China
Get access

Abstract

Polypropylene (PP) and amorphous selenium (a-Se) were used as prototype materials at room temperature to explore the problems that may exist in the accurate measurement of the reduced modulus of viscoelastic materials using depth-sensing nanoindentation. As has been reported previously by others, we observed that a “nose” in the load-displacement curve may occur during unloading, indicating significant creep effects at the onset of unloading. To accurately measure the elastic modulus in viscoelastic materials like PP or a-Se, both the contact stiffness and the contact area at the onset of unloading must be determined accurately. The issue of removing the influence of creep on the measurement of the contact stiffness using the Oliver-Pharr method has been addressed in a previous paper by Feng and Ngan. In this work, the effect of creep on contact-depth measurement is considered. Removal of creep effects in both contact stiffness and contact-area measurement leads to satisfactory prediction of the reduced moduli in PP and a-Se.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 5 , May 2003 , pp. 1141 - 1148
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7, 1564 (1992).CrossRefGoogle Scholar
2.Pharr, G.M. and Bolshakov, A., J. Mater. Res. 17, 2660 (2002).CrossRefGoogle Scholar
3.Feng, G. and Ngan, A.H.W., J. Mater. Res. 17, 660 (2002).CrossRefGoogle Scholar
4.Feng, G. and Ngan, A.H.W., in Fundamentals of Nanoindentation and Nanotribology II, edited by Baker, S.P., Cook, R.F., Corcoran, S.G., and Moody, N.R. (Mater. Res. Soc. Symp. Proc. 649, Warrendale, PA, 2001), p. Q7.1.1.Google Scholar
5.Sakai, M. and Shimizu, S., J. Non-Cryst. Solids 282, 236 (2001).CrossRefGoogle Scholar
6.Asif, S.A. Syed and Pethica, J.B., Philos. Mag. A 76, 1105 (1997).CrossRefGoogle Scholar
7.Beake, B.D. and Leggett, G.J., Polymer 43, 319 (2002).CrossRefGoogle Scholar
8.Chudoba, T. and Richter, F., Surf. Coat. Technol. 148, 191 (2001).CrossRefGoogle Scholar
9.Li, X. and Bhushan, B., Mater. Charact. 47, 1 (2002).Google Scholar
10.Low, I.M., Mater. Res. Bull. 33, 1753 (1998).Google Scholar
11.Harris, T.K., Brookes, E.J., and Daniel, R., Int. J. Refract. Met. Hard Mater. 17, 33 (1999).CrossRefGoogle Scholar
12.Asif, S.A. Syed and Pethica, J.B., in Thin Films: Stresses and Mechanical Properties VI, edited by Gerberich, W.W., Gao, H., Sundgren, J-E., and Baker, S.P. (Mater. Res. Soc. Symp. Proc. 436, Pittsburgh, PA, 1996), p. 201.Google Scholar
13.Elmustafa, A.A. and Stone, D.S., Acta Mater. 50, 3641 (2002).Google Scholar
14.Sakai, M., Shimizu, S., Miyajima, N., Tanabe, Y., and Yasuda, E., Carbon 39, 605 (2001).CrossRefGoogle Scholar
15.Lucas, B.N. and Oliver, W.C., Metall. Mater. Trans. A 30A, 601 (1999).CrossRefGoogle Scholar
16.Tsui, T.Y. and Pharr, G.M., J. Mater. Res. 14, 292 (1999).CrossRefGoogle Scholar
17.Ngan, A.H.W. and Tang, B., J. Mater. Res. 17, 2604 (2002).Google Scholar
18.Sneddon, I.N., Int. J. Eng. Sci. 3, 47 (1965).CrossRefGoogle Scholar
19.Etienne, S., Guenin, G., and Perez, J., J. Phys. D 12, 2189 (1979).Google Scholar
20.Ashby, M.F. and Jones, D.R.H., Engineering Materials (Pergamon Press, Oxford, U.K., 1986), p. 31.Google Scholar
21.Böhmer, R. and Angell, C.A., Phys. Rev. B 48, 5857 (1993).CrossRefGoogle Scholar