Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-26T18:42:39.207Z Has data issue: false hasContentIssue false

Transition from a punched-out dislocation to a slip dislocation revealed by electron tomography

Published online by Cambridge University Press:  31 January 2011

Masaki Tanaka*
Affiliation:
Department of Materials Science and Engineering, Kyushu University Nishi-ku, Fukuoka 819-0395, Japan
Grace S. Liu
Affiliation:
Department of Materials Science and Engineering, University of Illinois, Urbana, Illinois 61801
Tomonobu Kishida
Affiliation:
Department of Materials Science and Engineering, Kyushu University Nishi-ku, Fukuoka 819-0395, Japan
Kenji Higashida
Affiliation:
Department of Materials Science and Engineering, Kyushu University Nishi-ku, Fukuoka 819-0395, Japan
Ian M. Robertson
Affiliation:
Department of Materials Science and Engineering, University of Illinois, Urbana, Illinois 61801
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Punched-out dislocations emitted from an octahedral oxide precipitate in single-crystal silicon were investigated using high-voltage electron microscopy and tomography (HVEM-tomography) to understand the mechanism of softening caused by the oxide precipitates. In the present paper, direct evidence of the transition of a punched-out prismatic dislocation loop to a slip dislocation is presented. The punched-out dislocation grows into a large matrix dislocation loop by absorption of interstitial atoms, which were produced during oxide precipitation.

Type
Articles
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

b)

Present address: Mitsubishi Heavy Industries, Ltd., 10 Ooe-cho, Minato-ku, Nagoya, 455-8515 Japan.

c)

This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/jmr_policy

References

REFERENCES

1.Borghesi, A., Pivac, B., Sassella, A., Stella, A.: Oxygen precipitation in silicon. J. Appl. Phys. 77, 4169 (1995)CrossRefGoogle Scholar
2.Sueoka, K., Ikeda, N., Yamamoto, T., Kabayashi, S.: Morphology change of oxide precipitates in CZ silicon during 2-step annealing. J. Electrochem. Soc. 141, 3588 (1994)CrossRefGoogle Scholar
3.Jurkschat, K., Senkader, S., Wilshaw, P.R.: Onset of slip in silicon containing oxide precipitates. J. Appl. Phys. 90, 3219 (2001)CrossRefGoogle Scholar
4.Giannattasio, A., Senkader, S., Falster, R.J., Wilshaw, P.R.: The role of prismatic dislocation loops in the generation of glide dislocations in Cz-silicon. Comput. Mater. Sci. 30, 131 (2004)CrossRefGoogle Scholar
5.Yonenaga, I., Sumino, K.: Mechanical behavior of Czochralski-silicon crystals as affected by precipitation and dissolution of oxygen atoms. Jpn. J. Appl. Phys. 21, 47 (1982)CrossRefGoogle Scholar
6.Leroy, B., Plougonven, C.: Warpage of silicon wafers. J. Electrochem. Soc. 127, 961 (1980)CrossRefGoogle Scholar
7.Yashutake, K., Umeno, M., Kawabe, H.: Mechanical properties of heat-treated Czochralski-grown silicon crystals. Appl. Phys. Lett. 37, 787 (1980)Google Scholar
8.Behrensmeier, R., Brede, M., Haasen, P.: The influence of precipitated oxygen on the brittle-ductile transition of silicon. Scr. Metall. 21, 1581 (1987)CrossRefGoogle Scholar
9.Sueoka, K., Akatsuka, M., Katahama, H.: Dependence of mechanical strength of Czochralski silicon wafers on temperature of oxygen precipitation annealing. J. Electrochem. Soc. 144, 1111 (1997)CrossRefGoogle Scholar
10.Barnard, J.S., Sharp, J., Tong, J.R., Midgley, P.A.: High-resolution three-dimensional imaging of dislocations. Science 313, 319 (2006)CrossRefGoogle ScholarPubMed
11.Sharp, J.H., Barnard, J.S., Kaneko, K., Higashida, K., Midgley, P.A.: Dislocation tomography made easy: A reconstruction from ADF STEM images obtained using automated image shift correction. J. Phys. Conf. Ser. 126, 012013 (2008)CrossRefGoogle Scholar
12.Tanaka, M., Higashida, K., Kaneko, K., Hata, S., Mitsuhara, M.: Crack tip dislocations revealed by electron tomography in silicon single crystal. Scr. Mater. 59, 901 (2008)CrossRefGoogle Scholar
13.Ponce, F.A., Hahn, S.: Structure of thermally-induced microdefects in Czochralski silicon, Electron Microscopy of Materials edited by W.A. Krakow, D.A. Smith, and L.W. Hobbs (Mater. Res. Soc. Symp. Proc 31, North-Holland, New York 1984)153 Google Scholar
14.Hirth, J.P., Lothe, J.: Theory of Dislocations (McGraw-Hill, New York 1986)Google Scholar
15.Dieter, G.E.: Mechanical Metallurgy 2nd ed (McGraw-Hill Book Company, New York 1976)Google Scholar
16.Tanaka, M., Sadamatsu, S., Liu, G.L., Nakamura, H., Hgashida, K., Robertson, I.M.: Sequential multiplication of dislocation sources along a crack front revealed by HVEM-tomography. J. Mater. Res. (submitted)Google Scholar
17.Tan, T.Y., Tice, W.K.: Oxygen precipitation and the generation of dislocations in silicon. Philos. Mag. 34, 615 (1976)CrossRefGoogle Scholar
18.Tan, T.Y.: Exigent-accommodation volume of precipitation and formation of oxygen precipitates in silicon, Oxygen, Carbon, Hydrogen and Nitrogen in Crystalline Silicon edited by J.C. Mikkelsen, Jr., S.J. Pearton, J.W. Corbett, and S.J. Pennycook (Mater. Res. Soc. Symp. Proc 59, Pittsburgh, PA 1986)269 Google Scholar

Tanaka et al. supplementary material

Movie 1

Download Tanaka et al. supplementary material(Video)
Video 4.6 MB

Tanaka et al. supplementary material

Movie 2

Download Tanaka et al. supplementary material(Video)
Video 7.3 MB