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Tin Whiskers of Bulk Solders Generated Under Resonance

Published online by Cambridge University Press:  01 June 2005

Jenn-Ming Song ,
Truan-Sheng Lui ,
Yea-Luen Chang  and
Li-Hui Chen
Jenn-Ming Song*
Affiliation:
Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974, Taiwan, Republic of China
Truan-Sheng Lui
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan, Republic of China
Yea-Luen Chang
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan, Republic of China
Li-Hui Chen
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan, Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

In this study, we investigated the vibration properties of Sn–Zn and Sn–Zn–Al alloys. It is notable that, with a small amount of Al addition, Sn whiskers were generated during resonant vibration. This may be the first time that Sn whiskers were found on bulk materials. Microstructural refining and hardening caused by alloying of Al stunted the fiberous type Sn deformation within Sn–Zn eutectics. Vibration-induced extrusion of Zn-free regions in the vicinity of cell boundaries may account for the appearance of the whiskers.

Keywords

AlloyMicrostructureMechanical properties
Type
Rapid Communications
Information
Journal of Materials Research , Volume 20 , Issue 6 , June 2005 , pp. 1385 - 1388
Copyright
Copyright © Materials Research Society 2005

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References

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