Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-23T00:37:46.988Z Has data issue: false hasContentIssue false
  • English
  • Français

Tin Whiskers of Bulk Solders Generated Under Resonance

Published online by Cambridge University Press:  01 June 2005

Jenn-Ming Song ,
Truan-Sheng Lui ,
Yea-Luen Chang  and
Li-Hui Chen
Jenn-Ming Song*
Affiliation:
Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974, Taiwan, Republic of China
Truan-Sheng Lui
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan, Republic of China
Yea-Luen Chang
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan, Republic of China
Li-Hui Chen
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan, Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

In this study, we investigated the vibration properties of Sn–Zn and Sn–Zn–Al alloys. It is notable that, with a small amount of Al addition, Sn whiskers were generated during resonant vibration. This may be the first time that Sn whiskers were found on bulk materials. Microstructural refining and hardening caused by alloying of Al stunted the fiberous type Sn deformation within Sn–Zn eutectics. Vibration-induced extrusion of Zn-free regions in the vicinity of cell boundaries may account for the appearance of the whiskers.

Keywords

AlloyMicrostructureMechanical properties
Type
Rapid Communications
Information
Journal of Materials Research , Volume 20 , Issue 6 , June 2005 , pp. 1385 - 1388
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Yang, W., Messler, R.W.: Microstructure evolution of eutectic Sn–Ag solder joints. J. Electron. Mater. 23, 765 (1994).CrossRefGoogle Scholar
2Mavoori, H., Chin, J., Vaynman, S., Moran, B., Keer, L. and Fine, M.E.: Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn–Zn eutectic solders. J. Electron. Mater. 26, 1269 (1997).CrossRefGoogle Scholar
3Hua, F. and Glazer, J. Lead-free solders for electronic assembly, in Design & Reliability of Solders and Solder Interconnections, edited by Mahidhara, R.K., Frear, D.R., Sastry, S.M.L., Murty, K.L., Liaw, P.K., and Winterbottom, W.L. (TMS, Warrendale, PA, 1997), p. 65.Google Scholar
4Vaynman, S. and Fine, M.E.: Development of fluxes for lead-free solders containing zinc. Scripta Mater. 41, 1269 (1999).CrossRefGoogle Scholar
5Lin, K.L. and Liu, T.P.: High-temperature oxidation of a Sn–Zn–Al solder. Oxid. Met. 50, 255 (1998).CrossRefGoogle Scholar
6Huang, C.W. and Lin, K.L.: Wetting properties of and interfacial reactions in lead-free Sn–Zn based solders on and Cu plated with an electroless Ni-P/Au layer. Mater. Trans. 45, 588 (2004).CrossRefGoogle Scholar
7Chuang, C.M., Lui, T.S. and Chen, L.H.: Effect of aluminum addition on tensile properties of naturally aged Sn–9Zn eutectic solder. J. Mater. Sci. 37, 191 (2002).CrossRefGoogle Scholar
8Yang, Q.J., Pang, H.L.J., Wang, Z.P., Lim, G.H., Yap, F.F. and Lin, R.M.: Vibration reliability characterization of PBGA assemblies. Microelectronic Reliability 40, 1097 (2000).CrossRefGoogle Scholar
9Zhao, Y., Basaran, C., Cartwright, A. and Dishongh, T. Inelastic behavior of microelectronics solder joints under concurrent vibration and thermal cycling, in The 7th Intersociety Conference on Thermal and Thermechanical Phenomena in Electronic Systems, edited by Kromann, G.B., Culham, J.R., and Ramakrishna, K. (IEEE, Piscataway, NJ, 2000), p. 349.Google Scholar
10Song, J.M., Li, F.I., Lui, T.S. and Chen, L.H.: Investigation of vibration fracture behavior of Sn–Ag–Cu solders under resonance. J. Mater. Res. 19, 2665 (2004).CrossRefGoogle Scholar
11Lau, J.H., Wong, C.P., Lee, N-C. and Lee, S.W.R.Electronics manufacturing with lead-free, halogen-free and conductive-adhesive materials (McGraw-Hill Companies, New York, NY, 2003), p. 16.5.Google Scholar
12Sheng, G.T.T., Hu, C.F., Choi, W.J., Tu, K.N., Bong, Y.Y. and Nguyen, L.: Tin whiskers studied by focusd ion beam imaging and transmission electron microscopy. J. Appl. Phys. 92, 64 (2002).CrossRefGoogle Scholar
13LeBret, J.B. and Norton, M.G.: Electron microscopy study of tin whisker growth. J. Mater. Res. 18, 585 (2003).CrossRefGoogle Scholar
14Liu, S.H., Chen, C., Liu, P.C. and Chou, T.: Tin whisker growth driven by electrical currents. J. Appl. Phys. 95, 7742 (2004).CrossRefGoogle Scholar
15Tu, K.N.: Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions. Phys. Rev. B 49, 2030 (1994).CrossRefGoogle ScholarPubMed
16Choi, W.J., Lee, T.Y., Tu, K.N., Tamura, N., Celestre, R.S., MacDowell, A.A. and Bong, Y.Y.: Luu Nguyen: Tin whiskers studied by synchrotron radiation scanning x-ray micro-diffraction. Acta Mater. 51, 6253 (2003).CrossRefGoogle Scholar
17Granato, A. and Lucke, K.: Theory of mechanical damping due to dislocations. J. App. Phys. 27, 583 (1956).CrossRefGoogle Scholar
18Granato, A. and Lucke, K.: Application of dislocation theory to internal friction phenomena at high frequencies. J. App. Phys. 27, 789 (1956).CrossRefGoogle Scholar
19Song, J.M., Lui, T.S., Chen, L.H. and Tsai, T.Y.: Resonant vibration behavior of lead-free solders. J. Electron. Mater. 32, 1501 (2003).CrossRefGoogle Scholar
20Song, J. M., Lui, T. S., Chang, Y. L. and Chen, L. H. (unpublished).Google Scholar