Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-26T09:07:11.973Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermodynamics of (Cr, Mo, Nb, Ta, V, or W)–Si–Cu ternary systems

Published online by Cambridge University Press:  31 January 2011

J.S. Reid ,
E. Kolawa  and
M-A. Nicolet
J.S. Reid
Affiliation:
Department of Electrical Engineering, California Institute of Technology, Pasadena, California 91125
E. Kolawa
Affiliation:
Department of Electrical Engineering, California Institute of Technology, Pasadena, California 91125
M-A. Nicolet
Affiliation:
Department of Electrical Engineering, California Institute of Technology, Pasadena, California 91125
Get access

Abstract

The room-temperature and 700 °C tie lines of the early transition metal–Si–Cu ternary systems have been calculated for the metals Cr, Mo, Nb, Ta, V, and W. The tie lines are determined by considering only binary and elemental phases in observance of strict stoichiometry and zero solid solubility. We find that copper is stable with the majority of transition metal silicides under consideration at 700 °C. The result is relevant to the design of stable copper metallizations for silicon.

Type
Articles
Information
Journal of Materials Research , Volume 7 , Issue 9 , September 1992 , pp. 2424 - 2428
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Binary Alloy Phase Diagrams, edited by Massalski, T. B., Bennett, L.H., Murray, J. L., and Baker, H. (ASM INTERNATIONAL, Metals Park, OH, 1991).Google Scholar
2.Schlesinger, M. E., Chem. Rev. 90, 607 (1990).CrossRefGoogle Scholar
3.Kattelus, H. P. and Nicolet, M-A., in Diffusion Phenomena in Thin Films and Microelectron Materials, edited by Gupta, D. and Ho, P. S. (Noyes Publications, Park Ridge, NJ, 1988).Google Scholar
4.Chamberlain, M.B., Thin Solid Films 91, 155 (1982).CrossRefGoogle Scholar
5.Kolawa, E., Chen, J. S., Reid, J. S., Pokela, P. J., and Nicolet, M-A., J. Appl. Phys. 70, 1369 (1991).CrossRefGoogle Scholar
6.Kolawa, E., Pokela, P.J., Reid, J.S., Chen, J.S., Ruiz, R.P., and Nicolet, M-A., IEEE Electron Device Lett. 12, 321 (1991).CrossRefGoogle Scholar
7.Reid, J.S., Kolawa, E., Stephens, T.A., Chen, J.S., and Nicolet, M-A., in Advanced Metallization for ULSI Applications, edited by Rana, V. V. S., Joshi, R. V., and Ohdomari, I. (Mater. Res. Soc, Pittsburgh, PA, 1992), pp. 285–291.Google Scholar
8.Kolawa, E., Reid, J. S., and Nicolet, M-A., presented at the Advanced Metallization for ULSI Metallization Conference, Murray Hill, New Jersey, 1991 (unpublished).Google Scholar
9.Jangg, V. G., Kieffer, R., Blaha, A., and Sultan, T., Z. Metallk. 61, 670 (1972).Google Scholar
10.Villars, P. and Calvert, L.D., Pearson's Handbook of Crystallographic Data for Intermetallic Phases (American Society for Metals, Metals Park, OH, 1985).Google Scholar
11.Barin, I. and Knacke, O., Metall. Trans. 5, 1769 (1974).CrossRefGoogle Scholar
12.Barin, I., Thermochemical Data of Pure Substances (VCH Verlagsgesellschaft mbH, D-6940 Weinheim, Germany, 1989).Google Scholar
13.Chart, T. G., National Physical Laboratory, Report DCS 18 (1972).Google Scholar
14.Barin, I. and Knacke, O., Thermochemical Properties of Inorganic Substances (Springer, Berlin, 1973 plus the 1975 supplement).Google Scholar
15.Chart, T. G., High Temp.-High Press. 5, 241 (1973).Google Scholar
16.Liidecke, D., CALPHAD 11, 135 (1987).CrossRefGoogle Scholar
17.Lukas, H. L., Henig, E. Th., and Zimmerman, B., CALPHAD 1,Google Scholar
18.Stolt, L., Charai, A., d'Heurle, F.M., Fryer, P.M., and Harper, J. M. E., J. Vac. Sci.-A 9, 1501 (1991).CrossRefGoogle Scholar
19.Harper, J.M.E., Charai, A., Stolt, L., d'Heurle, F.M., and Fryer, P.M., Appl. Phys. Lett. 56, 2519 (1990).CrossRefGoogle Scholar
20.Meschel, S.V. and Kleppa, O.J., Metall. Trans. A 22A, 2162(1991).CrossRefGoogle Scholar
21.Miedema, A. R., Boom, R., and De Boer, F. R., J. Less-Common Metals 41, 117 (1975).CrossRefGoogle Scholar
22.Miedema, A. R., J. Less-Common Metals 46, 67 (1976).CrossRefGoogle Scholar
23.Kaufman, L., CALPHAD 3, 45 (1979).CrossRefGoogle Scholar
24.Beyers, R., J. Appl. Phys. 64, 147 (1984).CrossRefGoogle Scholar
25.Schmid-Fetzer, R., in Thermochemistry of Alloys, edited by Brodowsky, H and Schaller, H-J. (Kluwer Academic PublishersBoston, MA, 1989), pp. 107–117CrossRefGoogle Scholar
26.Koster, U. and Herold, U., in Glassy Metals I, edited by Giintherodt, H-J. and Beck, H. (Springer-Verlag, New York, 1981),. pp. 225–257.CrossRefGoogle Scholar