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Stress-assisted-electrochemical corrosion of Cu-based bulk metallic glass

Published online by Cambridge University Press:  31 January 2011

Ding Li ,
Mimi Yang ,
Fuqian Yang  and
Peter K. Liaw
Ding Li
Affiliation:
Materials Program, Department of Chemical and Materials Engineering, University of Kentucky, Lexington, Kentucky 40506
Mimi Yang
Affiliation:
MSTC Program, Paul Laurence Dunbar High School, Lexington, Kentucky 40513
Fuqian Yang*
Affiliation:
Materials Program, Department of Chemical and Materials Engineering, University of Kentucky, Lexington, Kentucky 40506
Peter K. Liaw
Affiliation:
Department of Materials Science and Engineering, University of Tennessee, Knoxville, Tennessee 37994
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Using the microindentation test, the stress-assisted-electrochemical corrosion of Cu46.25Zr45.25Al7.5Er1 bulk metallic glass (BMG) was studied in a 10 wt% NaCl electrolyte. The microindentation was performed in an indentation load range of 500 to 4000 mN to create shear bands over the deformation zone. Electric current of various densities was passed through the indented BMGs to evaluate the effect of shear bands and localized deformation on the electrochemical corrosion of the BMGs. Surface pits always initiated from the shear-banding zone and the contact edges between the indenter and the BMGs, and the size of the corroded zone grew with the increase in the polarization time, the indentation load, and the current density. Wormlike amorphous whiskers were formed over the corroded zone, and the density of the wormlike whiskers increased with the current density and polarization time.

Keywords

AmorphousNanoindentation
Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 3 , March 2010 , pp. 592 - 597
Copyright
Copyright © Materials Research Society 2010

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