Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Chason, E.
Sheldon, B. W.
Freund, L. B.
Floro, J. A.
and
Hearne, S. J.
2002.
Origin of Compressive Residual Stress in Polycrystalline Thin Films.
Physical Review Letters,
Vol. 88,
Issue. 15,
O’Hayre, Ryan
Lee, Sang-Joon
Cha, Suk-Won
and
Prinz, Fritz.B
2002.
A sharp peak in the performance of sputtered platinum fuel cells at ultra-low platinum loading.
Journal of Power Sources,
Vol. 109,
Issue. 2,
p.
483.
Barnat, E. V.
Nagakura, D.
Wang, P.-I.
and
Lu, T.-M.
2002.
Real time resistivity measurements during sputter deposition of ultrathin copper films.
Journal of Applied Physics,
Vol. 91,
Issue. 3,
p.
1667.
Chason, E.
and
Sheldon, B. W.
2003.
Monitoring Stress in Thin Films during Processing.
Surface Engineering,
Vol. 19,
Issue. 5,
p.
387.
Seel, Steven C.
and
Thompson, Carl V.
2003.
Tensile stress generation during island coalescence for variable island-substrate contact angle.
Journal of Applied Physics,
Vol. 93,
Issue. 11,
p.
9038.
Labat, S.
Bocquet, F.
Bigault, T.
Roussel, L.
Mikaelian, G.
Alfonso, C.
Charai, A.
and
Thomas, O.
2003.
The early stages of stress development during epitaxial growth of Ag/Cu multilayers.
MRS Proceedings,
Vol. 791,
Issue. ,
Labat, S.
Bocquet, F.
Gilles, B.
and
Thomas, O.
2004.
Stresses and interfacial structure in Au–Ni and Ag–Cu metallic multilayers.
Scripta Materialia,
Vol. 50,
Issue. 6,
p.
717.
Lim, Ji-Eun
Jeong, Jae Kyeong
Ahn, Kun Ho
Kim, Hyeong Joon
Hwang, Cheol Seong
Park, Dong-Yeon
and
Lee, Dong-Su
2004.
Microstructural characterization of sputter-deposited Pt thin film electrode.
Journal of Materials Research,
Vol. 19,
Issue. 2,
p.
460.
Lee, Alan
Clemens, B.M
and
Nix, W.D
2004.
Stress induced delamination methods for the study of adhesion of Pt thin films to Si.
Acta Materialia,
Vol. 52,
Issue. 7,
p.
2081.
Lim, Ji-Eun
Jeong, Jae Kyeong
Ahn, Kun Ho
Kim, Hyeong Joon
Hwang, Cheol Seong
Park, Dong-Yeon
and
Lee, Dong-Su
2004.
Microstructural characterization of sputter-deposited Pt thin film electrode.
Journal of Materials Research,
Vol. 19,
Issue. 2,
p.
460.
Lee, Byeongdu
Seifert, Sönke
Riley, Stephen J.
Tikhonov, George
Tomczyk, Nancy A.
Vajda, Stefan
and
Winans, Randall E.
2005.
Anomalous grazing incidence small-angle x-ray scattering studies of platinum nanoparticles formed by cluster deposition.
The Journal of Chemical Physics,
Vol. 123,
Issue. 7,
Jacobsohn, L. G.
Zhang, X.
Misra, A.
and
Nastasi, M.
2005.
Synthesis of metallic nanocrystals with size and depth control: A case study.
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena,
Vol. 23,
Issue. 4,
p.
1470.
Seel, Steven C.
Hoyt, Jeffrey J.
Webb, Edmund B.
and
Zimmerman, Jonathan A.
2006.
Modeling metallic island coalescence stress via adhesive contact between surfaces.
Physical Review B,
Vol. 73,
Issue. 24,
Mayer, James
Nastasi, Michael
and
Misra, Amit
2007.
Materials Processing Handbook.
p.
10-1.
Misra, Amit
and
Nastasi, Michael
2007.
Radiation Effects in Solids.
Vol. 235,
Issue. ,
p.
487.
Yu-Zhang, K.
Embury, J.D.
Han, K.
and
Misra, A.
2008.
Transmission electron microscopy investigation of the atomic structure of interfaces in nanoscale Cu–Nb multilayers.
Philosophical Magazine,
Vol. 88,
Issue. 17,
p.
2559.
Nix, William D.
2009.
Exploiting New Opportunities in Materials Research by Remembering and Applying Old Lessons.
MRS Bulletin,
Vol. 34,
Issue. 2,
p.
82.
Birringer, Ryan P.
Lu, Ching-Huang
Deal, Michael
Nishi, Yoshio
and
Dauskardt, Reinhold H.
2010.
Bilayer metal gate electrodes with tunable work function: Adhesion and interface characterization.
Journal of Applied Physics,
Vol. 108,
Issue. 5,
Nix, W.D.
2014.
Metallic Films for Electronic, Optical and Magnetic Applications.
p.
353.
Schubert, Christian
2014.
Magnetic Order and Coupling Phenomena.
p.
51.