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Residual stress in as-deposited Al–Cu–Fe–B quasicrystalline thin films

Published online by Cambridge University Press:  16 December 2011

Sergey Polishchuk ,
Pascal Boulet ,
André Mézin ,
Marie-Cécile de Weerd ,
Sylvain Weber ,
Julian Ledieu ,
Jean-Marie Dubois  and
Vincent Fournée
Sergey Polishchuk
Affiliation:
Institut Jean Lamour, UMR7198 CNRS–Nancy Université–UPV Metz, École des Mines, 54042 Nancy, France
Pascal Boulet
Affiliation:
Institut Jean Lamour, UMR7198 CNRS–Nancy Université–UPV Metz, École des Mines, 54042 Nancy, France
André Mézin
Affiliation:
Institut Jean Lamour, UMR7198 CNRS–Nancy Université–UPV Metz, École des Mines, 54042 Nancy, France
Marie-Cécile de Weerd
Affiliation:
Institut Jean Lamour, UMR7198 CNRS–Nancy Université–UPV Metz, École des Mines, 54042 Nancy, France
Sylvain Weber
Affiliation:
Institut Jean Lamour, UMR7198 CNRS–Nancy Université–UPV Metz, École des Mines, 54042 Nancy, France
Julian Ledieu
Affiliation:
Institut Jean Lamour, UMR7198 CNRS–Nancy Université–UPV Metz, École des Mines, 54042 Nancy, France
Jean-Marie Dubois
Affiliation:
Institut Jean Lamour, UMR7198 CNRS–Nancy Université–UPV Metz, École des Mines, 54042 Nancy, France
Vincent Fournée*
Affiliation:
Institut Jean Lamour, UMR7198 CNRS–Nancy Université–UPV Metz, École des Mines, 54042 Nancy, France
*
aAddress all correspondence to this author. e-mail: [email protected]
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Abstract

The residual stress in Al–Cu–Fe–B quasicrystalline thin films has been characterized by x-ray diffraction and the curvature method. Films with thicknesses in a range from 0.55 to 2.6 μm were deposited using magnetron sputtering on Si(100) substrates maintained at a temperature of 560 °C. It is found that the tensile stress in uncracked films as determined by the curvature method is close to that measured by a modified sin2ψ method using main diffraction peaks of the icosahedral structure and corresponds approximately to 1.1 GPa. This value is close to that of the thermal stress estimated from the mismatch between thermal expansion coefficients of the film and substrate, suggesting that thermal stress is the main source of residual stress. Increasing film thickness results in the development of cracks and partial delamination of the film, accompanied by the sudden decrease of the stress. The fracture toughness of the quasicrystalline films is estimated between 1.5 and 1.9 MPa.

Keywords

QuasicrystalPhysical vapor depositionCoating
Type
Articles
Information
Journal of Materials Research , Volume 27 , Issue 5: Focus Issue: Plasma and Ion-Beam Assisted Materials Processing , 14 March 2012 , pp. 837 - 844
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

1.Sordelet, D.J. and Dubois, J.M.: Quasicrystals: Perspectives and potential applications. MRS Bull. 22, 4 (1997).CrossRefGoogle Scholar
2.Dubois, J.M., Kang, S.S., and von Stebut, J.: Quasicrystalline low-friction coatings. J. Mater. Sci. Lett. 10, 537 (1991).CrossRefGoogle Scholar
3.Tsui, Y.C. and Clyne, T.W.: An analytical model for predicting residual stresses in progressively deposited coatings: Part 1: Planar geometry. Thin Solid Films 306, 23 (1997).CrossRefGoogle Scholar
4.Vaz, F., Rebouta, L., Goudeau, P., Rivière, J.P., Schäffer, E., Kleer, G., and Bodmann, M.: Residual stress states in sputtered Ti1-xSixNy films. Thin Solid Films 402, 195 (2002).CrossRefGoogle Scholar
5.Zhao, Z.B., Hershberger, J., Yalison, S.M., and Bilello, J.C.: Determination of residual stress in thin films: A comparative study of x-ray topography versus laser curvature method. Thin Solid Films 415, 21 (2002).CrossRefGoogle Scholar
6.Clyne, T.W.: Residual stresses in coated and layered systems, in Encyclopedia of Materials: Science and Technology (Elsevier Science Ltd., Oxford, U.K., 2001), pp. 8126, 8134.CrossRefGoogle Scholar
7.Ganne, T., Crépin, J., Serror, S., and Zaoui, A.: Cracking behaviour of PVD tungsten coatings deposited on steel substrates. Acta Mater. 50, 4149 (2002).CrossRefGoogle Scholar
8.Pauleau, Y.: Generation and evolution of residual stresses in physical vapour-deposited thin films. Vacuum 61, 175 (2001).CrossRefGoogle Scholar
9.Anders, A.: A structure zone diagram including plasma-based deposition and ion etching. Thin Solid Films 518, 4087 (2010).CrossRefGoogle Scholar
10.Ohring, M.: Materials Science of Thin films, Deposition and Structure, 2nd ed. (Academic Press, Waltham, MA, 2002), pp. 497, 504.Google Scholar
11.Joulaud, J.L., Diot, C., and Donnadieu, P.: Structural analysis of quasicrystalline coatings obtained by cathodic sputtering, in Proceedings of fifth International Conference on Quasicrystals, edited by Janot, C. and Mosseri, R. (World Scientific, Singapore, 1995), pp. 726, 729.Google Scholar
12.Duguet, T., Fournée, V., Dubois, J.M., and Belmonte, T.: Study by optical emission spectroscopy of a physical vapour deposition process for the synthesis of complex AlCuFe(B) coatings. Surf. Coat. Technol. 205, 9 (2010).CrossRefGoogle Scholar
13.Ma, C.H., Huang, J.H., and Chen, H.: Residual stress measurement in textured thin film by grazing-incidence x-ray diffraction. Thin Solid Films 418, 73 (2002).CrossRefGoogle Scholar
14.Cahn, J.W., Shechtman, D., and Gratias, D.: Indexing icosahedral quasiperiodic crystal. J. Mater. Res. 1, 13 (1986).CrossRefGoogle Scholar
15.Mézin, A.: Coating internal stress measurement through the curvature method: A geometry-based criterion delimiting the relevance of Stoney’s formula. Surf. Coat. Technol. 200, 5259 (2006).CrossRefGoogle Scholar
16.Pinhero, P.J., Chang, S.L., Anderegg, J.W., and Thiel, P.A.: Effect of water on the surface oxidation of an Al-Pd-Mn quasicrystal. Philos. Mag. B 75, 271 (1997).CrossRefGoogle Scholar
17.Gil-Gavatz, M., Rouxel, D., Pigeat, P., Weber, B., and Dubois, J.M.: Surface oxidation of the Al62Cu25.5Fe12.5 icosahedral quasicrystal. Philos. Mag. A 80, 2083 (2000).CrossRefGoogle Scholar
18.Tsai, A.P., Inoue, A., and Masumoto, T.: Effects of preparation conditions and additional elements on phason strains in stable icosahedral quasicrystals in Al-Cu-Fe systems. J. Mater. Sci. Lett. 8, 470 (1989).CrossRefGoogle Scholar
19.Wang, Y., Zhang, Z., Geng, H., and Yang, Z.: Formation of the icosahedral quasicrystalline phase in a rapidly solidified Al52Cu25.5Fe12.5Si10 alloy. Mater. Charact. 56, 200 (2006).CrossRefGoogle Scholar
20.Cheary, R.W., Coelho, A.A., and Cline, J.P.: Fundamental parameters line profile fitting in laboratory diffractometers. J. Res. Natl. Inst. Stand. Technol. 109, 1 (2004).CrossRefGoogle ScholarPubMed
21.Takeuchi, S.: Bulk mechanical properties of quasicrystals, in Quasicrystals, edited by Dubois, J-M., Thiel, P.A., Tsai, A-P., and Urban, K. (Mater. Res. Soc. Symp. Proc. 553, Warrendale, PA, 1999), p. 283.Google Scholar
22.Gnaupel-Herold, T., Prask, H., and Biancaniello, F.: Residual stresses and elastic constants in thermal deposits, in Recent Advances in Experimental Mechanics, edited by Gdoutos, E.E. (Kluwer Academic Publishers, Dordrecht, 2002), pp. 507, 514.Google Scholar
23.Birkholz, M., Fewster, P.F., and Genzel, C.: Thin Film Analysis by X-Ray Scattering (Wiley-VCH, Weinheim, 2006), pp. 239, 291.Google Scholar
24.Hopcroft, M.A., Nix, W.D., and Kenny, T.W.: What is the Young’s modulus of silicon? J. Microelectromech. Syst. 19, 229 (2010).CrossRefGoogle Scholar
25.Mazur, A.V. and Gasik, M.M.: Thermal expansion of silicon at temperatures up to 1100 °C. J. Mater. Process. Technol. 209, 723 (2009).CrossRefGoogle Scholar
26.Quivy, A., Lefebvre, S., Soubeyroux, J.L., Filhol, A., Bellisent, R., and Ibberson, R.M.: High-resolution time-of-flight measurements of the lattice parameter and thermal expansion of the icosahedral phase Al62Cu25.5Fe12.5. J. Appl. Cryst. 27, 1010 (1994).CrossRefGoogle Scholar
27.Mézin, A.: An analytical solution for stress relaxation in cracked coatings. Surf. Coat. Technol. 166, 160 (2003).CrossRefGoogle Scholar
28.Milman, Y.V., Lotsko, D.V., Dub, S.N., Ustinov, A.I., Polishchuk, S.S., and Ulshin, S.V.: Mechanical properties of quasicrystalline Al-Cu-Fe coatings with submicron-sized grains. Surf. Coat. Technol. 201, 5937 (2007).CrossRefGoogle Scholar
29.French, B.L., Daniels, M.J., and Bilello, J.C.: Investigation of the fracture toughness of radio frequency magnetron sputtered Al-Cu-Fe films via white-beam synchrotron radiography/topography. J. Phys. D: Appl. Phys. 38, A44 (2005).CrossRefGoogle Scholar
30.Beuth, J.L. and Klingbeil, N.W.: Cracking of thin films bonded to elastic plastic substrates. J. Mech. Phys. Solids 44, 1411 (1996).CrossRefGoogle Scholar
31.Vlassak, J.J.: Channel cracking in thin films on substrates of finite thickness. Int. J. Fract. 119–120, 299 (2003).CrossRefGoogle Scholar
32.Strawbridge, A. and Evans, H.E.: Mechanical failure of thin brittle coatings. Eng. Fail. Anal. 2, 85 (1995).CrossRefGoogle Scholar
33.Köster, U., Liu, W., Liebertz, H., and Michel, M.: Mechanical properties of quasicrystalline and crystalline phases in AlCuFe alloys. J. Non-Cryst. Solids 153–154, 446 (1993).CrossRefGoogle Scholar
34.Zhang, S., Sun, D., Fu, Y., and Du, H.S.: Toughness measurement of ceramic thin films by two-step uniaxial tensile method. Thin Solid Films 469–470, 233 (2004).CrossRefGoogle Scholar
35.Wellner, P., Kraft, O., Dehm, G., Andersons, J., and Arzt, E.: Channel cracking of β-NiAl thin films on Si substrates. Acta Mater. 52, 2325 (2004).CrossRefGoogle Scholar