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Preparation and characterization of CuN-based ternary alloy films using Cr or Zr for stabilizing N

Published online by Cambridge University Press:  27 February 2017

Yuehong Zheng ,
Xiaona Li ,
Yubo Liu ,
Wei Sun  and
Chuang Dong
Yuehong Zheng
Affiliation:
Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), Dalian University of Technology, Dalian 116024, Liaoning, China
Xiaona Li*
Affiliation:
Key Laboratory of Materials Modification by Laser, Ion and Electron Beams (Ministry of Education), Dalian University of Technology, Dalian 116024, Liaoning, China; and Changzhou Institute of Dalian University of Technology, Changzhou 213164, Jiangsu, China
Yubo Liu
Affiliation:
Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), Dalian University of Technology, Dalian 116024, Liaoning, China
Wei Sun
Affiliation:
Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), Dalian University of Technology, Dalian 116024, Liaoning, China
Chuang Dong
Affiliation:
Key Laboratory of Materials Modification by Laser, Ion and Electron Beams (Ministry of Education), Dalian University of Technology, Dalian 116024, Liaoning, China; and Changzhou Institute of Dalian University of Technology, Changzhou 213164, Jiangsu, China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The surface hardening of Cu is an effective way to keep good electrical conductivity and increase chemical inertness. Here, Cr and Zr are introduced into Cu films to stabilize N and increase the film hardness. CuN-based alloy films are prepared on single-crystal Si(100) substrates using magnetron sputtering. Cu(Cr, N) films are mainly composed of Cu and Cr2N nanocrystals while Cu and Zr2N nanocrystals compose Cu(Zr, N) films. The thermal stability of the ternary films comes from the strong interaction between Cr (or Zr) and N which is contributing to the generation of stable nitrides. In terms of resistivity and hardness, the Cu(Cr, N) and Cu(Zr, N) films prepared at the N2/Ar ratio of 1/10 show preferable properties. Especially, the Cu86.1Zr6.1N7.8 film exhibits the highest hardness (∼4.7 GPa) and lowest resistivity (63.6 μΩ·cm). The chemical inertness of Cu film can also be improved by adding Cr–N and Zr–N. These ternary films are expected to apply for Cu surface nitrogenization.

Keywords

Cunitridehardness
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 7 , 14 April 2017 , pp. 1333 - 1342
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Copyright
Copyright © Materials Research Society 2017 

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Footnotes

Contributing Editor: Yang-T. Cheng

References

REFERENCES

Huang, C.L., Lai, C.H., Tsai, P.H., Huang, H.A., Lin, J.C., and Lee, C.: Growth, thermal stability and Cu diffusivity of reactively sputtered NbN thin films as diffusion barriers between Cu and Si. ECS J. Solid State Sci. 2, N152 (2013).Google Scholar
Gupta, A., Wang, H., Kvit, A., Duscher, G., and Narayan, J.: Effect of microstructure on diffusion of copper in TiN films. J. Appl. Phys. 93, 5210 (2003).Google Scholar
Yao, B., Han, Z., Li, Y.S., Tao, N.R., and Lu, K.: Dry sliding tribological properties of nanostructured copper subjected to dynamic plastic deformation. Wear 271, 1609 (2011).CrossRefGoogle Scholar
Zhou, J.B., Gustafsson, T., and Garfunkel, E.: The structure and thermal behavior of Cu on ultrathin films of SiO2 on Si(111). Surf. Sci. 372, 21 (1997).Google Scholar
Chu, J.P., Lin, C.H., and John, V.S.: Cu films containing insoluble Ru and RuN x on barrierless Si for excellent property improvements. Appl. Phys. Lett. 91, 132109 (2007).Google Scholar
Li, X.N., Liu, L.J., Zhang, X.Y., Chu, J.P., Wang, Q., and Dong, C.: Barrierless Cu–Ni–Mo interconnect films with high thermal stability against silicide formation. J. Electron. Mater. 41, 3447 (2012).Google Scholar
Batra, I.S., Dey, G.K., Kulkarni, U.D., and Banerjee, S.: Microstructure and properties of a Cu–Cr–Zr alloy. J. Nucl. Mater. 299, 91 (2001).Google Scholar
Wang, D., Nakamine, N., and Hayashi, Y.: Properties of various sputter-deposited Cu–N thin films. J. Vac. Sci. Technol., A 16, 2084 (1998).Google Scholar
Liu, Z.Q., Wang, W.J., Wang, T.M., Chao, S., and Zheng, S.K.: Thermal stability of copper nitride films prepared by rf magnetron sputtering. Thin Solid Films 325, 55 (1998).Google Scholar
Maruyama, T. and Morishita, T.: Copper nitride and tin nitride thin films for write-once optical recording media. Appl. Phys. Lett. 69, 890 (1996).Google Scholar
Maya, L.: Copper nitride thin films prepared by dc sputtering. Mat. Res. Soc. Symp. Proc. 282, 203 (1993).CrossRefGoogle Scholar
Nosaka, T., Yoshitake, M., Okamoto, A., Ogawa, S., and Nakayama, Y.: Thermal decomposition of copper nitride thin films and dots formation by electron beam writing. Appl. Surf. Sci. 169, 358 (2001).Google Scholar
Li, X., Sun, W., Yan, H., Liu, K., Wang, X., and Luo, N.: Preparation of nano-Al2O3 dispersion strengthened coating on copper surface. Rare Metal Mat. Eng. 41, 32 (2012).Google Scholar
Cabrera, A.L., Kirner, J.F., and Armor, J.N.: Oxidation protection for a variety of transition metals and copper via surface silicides formed with silane containing atmospheres. J. Mater. Res. 6, 71 (1991).Google Scholar
Takeuchi, A. and Inoue, A.: Classification of bulk metallic glasses by atomic size difference, heat of mixing and period of constituent elements and its application to characterization of the main alloying element. Mater. Trans. 46, 2817 (2005).Google Scholar
Sangiovanni, D.G., Alling, B., Steneteg, P., Hultman, L., and Abrikosov, I.A.: Nitrogen vacancy, self-interstitial diffusion, and Frenkel-pair formation/dissociation in B1 TiN studied by ab initio and classical molecular dynamics with optimized potentials. Phys. Rev. B 91, 054301 (2015).Google Scholar
Mühlbacher, M., Bochkarev, A.S., Mendez-Martin, F., Sartory, B., Chitu, L., Popov, M.N., Puschnig, P., Spitaler, J., Ding, H., Schalk, N., Lu, J., Hultman, L., and Mitterer, C.: Cu diffusion in single-crystal and polycrystalline TiN barrier layers: A high-resolution experimental study supported by first-principles calculations. J. Appl. Phys. 118, 085307 (2015).Google Scholar
Laegreid, N. and Wehner, G.K.: Sputtering yields of metals for Ar+ and Ne+ ions with energies from 50 to 600 eV. J. Appl. Phys. 32, 365 (1961).CrossRefGoogle Scholar
Moulder, J.F., Stickle, W.F., Sobol, P.E., and Bomben, K.D.: Handbook of X-ray Photoelectron Spectroscopy: A Reference Book of Standard Spectra for Identification and Interpretation of XPS Data (Perkin-Elmer, Boca Raton, FL, 1992); pp. 77, 87, 109.Google Scholar
Conde, A., Cristóbal, A.B., Fuentes, G., Tate, T., and de Damborenea, J.: Surface analysis of electrochemically stripped CrN coatings. Surf. Coat. Technol. 201, 3588 (2006).Google Scholar
Kong, Q., Ji, L., Li, H., Liu, X., and Wang, Y.: Composition, microstructure, and properties of CrN x films deposited using medium frequency magnetron sputtering. Appl. Surf. Sci. 257, 2269 (2011).Google Scholar
Rizzo, A., Signore, M.A., Mirenghi, L., and Dimaio, D.: Deposition and properties of ZrN x films produced by radio frequency reactive magnetron sputtering. Thin Solid Films 515, 1486 (2006).Google Scholar
Lavigne, O., Alemany-Dumont, C., Normand, B., Berthon-Fabry, S., and Metkemeijeret, R.: Thin chromium nitride PVD coatings on stainless steel for conductive component as bipolar plates of PEM fuel cells: Ex-situ and in-situ performances evaluation. Int. J. Hydrogen Energy 37, 10789 (2012).Google Scholar
Cui, G., Lane, M., Vijayamohanan, K., and Ramanath, G.: Interfacial adhesion of Cu to self-Assembled monolayers on SiO2 . Mater. Res. Soc. Symp. Proc. 695, 329 (2002).Google Scholar
Cheng, Y. and Zheng, Y.F.: A study of ZrN/Zr coatings deposited on NiTi alloy by PIIID technique. IEEE Trans. Plasma Sci. 34, 1105 (2006).Google Scholar
Roman, D., Bernardi, J., de Amorim, C.L.G., de Souza, F.S., Spinelli, A., Giacomelli, C., Figueroa, C.A., R Baumvol, I.J., and Basso, R.L.O.: Effect of deposition temperature on microstructure and corrosion resistance of ZrN thin films deposited by DC reactive magnetron sputtering. Mater. Chem. Phys. 130, 147 (2011).Google Scholar