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Prediction of formation of intermetallic compounds in diffusion couples

Published online by Cambridge University Press:  31 January 2011

Huashan Liu ,
Hang Wang ,
Wenjun Zhu ,
Xiaoma Tao  and
Zhanpeng Jin
Huashan Liu*
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
Hang Wang
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
Wenjun Zhu
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
Xiaoma Tao
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
Zhanpeng Jin
Affiliation:
School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, People’s Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Formation of intermetallic compounds (IMCs) at the interface between two metals during soldering processing exerts much influence on the electrical and mechanical performance of integrate circuits (ICs). Considering both of the thermodynamic and kinetic factors (including nucleation and growth) on phase formation, a new model capable of predicting phase formation sequence at the interface between two metals with different structures has been proposed in this work. Application of this new model on the interfacial reactions between pure elemental pairs of metals such as Ni/Sn, Cu/In, Cu/Sn, and Co/Sn at different temperatures shows good agreement between predictions by this model and experimental observations.

Keywords

KineticsPhase transformationSoldering
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 6 , June 2007 , pp. 1502 - 1511
Copyright
Copyright © Materials Research Society2007

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References

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