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Numerical analysis of thermal energy charging performance of spherical Cu@Cr@Ni phase-change capsules for recovering high-temperature waste heat

Published online by Cambridge University Press:  05 January 2017

Huibin Li
Affiliation:
School of Engineering and Technology, China University of Geosciences, Beijing 100083, China; and National Engineering Laboratory for Hydrometallurgical Cleaner Production Technology, Key Laboratory of Green Process and Engineering, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China
Zhijian Peng*
Affiliation:
School of Engineering and Technology, China University of Geosciences, Beijing 100083, China
Bingqian Ma
Affiliation:
National Engineering Laboratory for Hydrometallurgical Cleaner Production Technology, Key Laboratory of Green Process and Engineering, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China
Peilun Wang
Affiliation:
School of Engineering and Technology, China University of Geosciences, Beijing 100083, China; and State Key Laboratory of Multiphase Complex Systems, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China
Jianqiang Li*
Affiliation:
National Engineering Laboratory for Hydrometallurgical Cleaner Production Technology, Key Laboratory of Green Process and Engineering, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China
*
a) Address all correspondence to these authors. e-mail: [email protected]
b) e-mail: [email protected]
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Abstract

Metallic phase-change materials (PCMs) attract much attention due to their high thermal conductivity in thermal energy storage. Our previous work reported a kind of Cu@Cr@Ni bilayer capsules, which could endure at least 1000 thermal cycles between 1323 and 1423 K without leakage, and might be a potential high-temperature metallic PCM. This study numerically investigates the thermal energy charging performance of Cu@Cr@Ni capsules for recovering high-temperature waste heat at both constant and periodically fluctuant heat transfer fluid temperatures. It was revealed that only a short and slight sloped melting platform existed in the curve of outlet temperature due to the ultrahigh thermal conductivity of copper; with higher inlet velocities, the outlet and mean temperatures of such PCM increased and meanwhile the energy transfer efficiency decreased; the outlet and mean temperatures of the PCM and the liquid fraction in it were rather insensitive to the period of the inlet temperature fluctuation; and the amplitude of inlet temperature fluctuation, ±50 K, was sharply reduced to 5 K due to the thermal damping of the PCM.

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Articles
Copyright
Copyright © Materials Research Society 2017 

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Footnotes

Contributing Editor: Yanchun Zhou

References

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