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A new method for measuring the strength and ductility of thin films

Published online by Cambridge University Press:  31 January 2011

David T. Read  and
James W. Dally
David T. Read
Affiliation:
Materials Reliability Division, National Institute of Standards and Technology, Boulder, Colorado 80303-3328
James W. Dally
Affiliation:
Mechanical Engineering Department, University of Maryland, College Park, Maryland 20742
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Abstract

A new method of measuring the mechanical strength of thin films is described. We prepare miniature arrays of four tensile specimens, each 0.25 mm wide, 1 mm long, and 2.2 μm thick, using deposition, patterning, and etching processes common to the semiconductor industry. Each array of four specimens is carried on and protected by a rectangular silicon frame. Thirty-six such specimens are produced on a single wafer. After a specimen frame is mounted, its vertical sides are severed without damaging the specimens. The load is applied by micrometers through a special tension spring. Tensile properties of a 2.2 μm thick Ti–Al–Ti film were determined.

Type
Articles
Information
Journal of Materials Research , Volume 8 , Issue 7 , July 1993 , pp. 1542 - 1549
Copyright
Copyright © Materials Research Society 1993

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References

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