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Microstructure and diffusion in Nb/NbSn2 metal bonding structure

Published online by Cambridge University Press:  03 March 2011

D.J. Werder ,
C.H. Chen ,
H.S. Chen  and
D.D. Bacon
D.J. Werder
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974-0636
C.H. Chen
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974-0636
H.S. Chen
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974-0636
D.D. Bacon
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974-0636
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Abstract

This communication reports on the microstructure and interdiffusion observed in a new NbSn2/Nb metallization structure on SiO2, previously reported [H. S. Chen et al., Appl. Phys. Lett. 66, 2191 (1995)]. The as-deposited NbSn2 layer was found to be amorphous. After heating, the NbSn2 becomes polycrystalline and heavily diffused with Au from the Au-Sn solder. The Nb layer remains pure and intact after heating. The microstructure, compositions, and phases of the Au-Sn solder layer are also presented.

Type
Rapid Communication
Information
Journal of Materials Research , Volume 10 , Issue 12 , December 1995 , pp. 2988 - 2991
Copyright
Copyright © Materials Research Society 1995

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References

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