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Microstructure and behavior of laser-mixed Cr/Ni films on Cu alloys

Published online by Cambridge University Press:  31 January 2011

C. W. Draper
Affiliation:
A T&T Engineering Research Center, Princeton, New Jersey 08540
J. P. Franey
Affiliation:
A T&T Bell Laboratories, Murray Hill, New Jersey 07974
J. M. Gibson
Affiliation:
A T&T Bell Laboratories, Murray Hill, New Jersey 07974
T. E. Graedel
Affiliation:
A T&T Bell Laboratories, Murray Hill, New Jersey 07974
D. C. Jacobson
Affiliation:
A T&T Bell Laboratories, Murray Hill, New Jersey 07974
G. W. Kammlott
Affiliation:
A T&T Bell Laboratories, Murray Hill, New Jersey 07974
J. M. Poate
Affiliation:
A T&T Bell Laboratories, Murray Hill, New Jersey 07974
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Abstract

Deposited thin films of Cr and Ni on Cu substrates have been melted and intermixed with a frequency-doubled Q-switched Nd:YAG laser. The laser pulses melt the thin films and a shallow portion of the substrate. Resolidification interface volocities are on the order of 1–10 m s−1. Rutherford backscattering, Auger spectroscopy, and energy dispersive x-ray mapping have been used to characterize the elemental distribution. Channeling and transmission electron microscopy were used to investigate the microstructure of the surfaces produced. In contrast to the binary Cr–Cu system, where extended solid solutions are produced, the Cr–Ni–Cu system results in a metallic glass surface. We have found that these metallic glass surfaces, which have been dubbed “stainless coppers,” exhibit excellent hydrogen sulfide corrosion resistance. Their contact resistance is low and stable over long periods of time and through tens of thousands of electronic dial switching cycles.

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Articles
Copyright
Copyright © Materials Research Society 1987

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References

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