Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-26T17:02:57.471Z Has data issue: false hasContentIssue false
  • English
  • Français

Metal reinforced thermal plasma diamond coatings

Published online by Cambridge University Press:  31 January 2011

C. Tsai ,
J. Nelson ,
W.W. Gerberich ,
J. Heberlein  and
E. Pfender
C. Tsai
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455
J. Nelson
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455
W.W. Gerberich
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455
J. Heberlein
Affiliation:
Department of Mechanical Engineering, University of Minnesota, Minneapolis, Minnesota 55455
E. Pfender
Affiliation:
Department of Mechanical Engineering, University of Minnesota, Minneapolis, Minnesota 55455
Get access

Abstract

A three-step process to produce wear-resistant, composite diamond coatings is presented. Diamonds are deposited by RF thermal plasma CVD, reinforced by an electroplated metal binder, and regrown to form a continuous film. Microscratching and pin-on-disk wear tests indicate that the three-step composite films are more adherent than plasma deposited diamonds alone.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 7 , Issue 8 , August 1992 , pp. 1967 - 1969
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Soderberg, S., Gerendas, A., and Sjostrand, M., Vacuum 41, 1317 (1990).CrossRefGoogle Scholar
2.Matsumoto, S., Hino, M., and Kobayashi, T., Appl. Phys. Lett. 51, 737 (1987).CrossRefGoogle Scholar
3.Meyer, D. E., Dillon, R. O., and Woollam, J. A., J. Vac. Sci. Technol. A7, 2325 (1989).CrossRefGoogle Scholar
4.Wu, T. W., J. Mater. Res. 6, 407 (1991).CrossRefGoogle Scholar
5.Tsai, C., Ventakataraman, S., Nelson, J. C., Gerberich, W., Lu, Z., Heberlein, J., and Pfender, E., in preparation.Google Scholar