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Measurement of electromigration parameters of lead-free SnAg3.5 solder using U-groove lines

Published online by Cambridge University Press:  03 March 2011

Ying-Chao Hsu ,
De-Chung Chen ,
P.C. Liu  and
Chih Chen
Ying-Chao Hsu
Affiliation:
National Chiao Tung University, Department of Material Science and Engineering,Hsin-chu 300, Taiwan, Republic of China
De-Chung Chen
Affiliation:
National Chiao Tung University, Department of Material Science and Engineering,Hsin-chu 300, Taiwan, Republic of China
P.C. Liu
Affiliation:
National Chiao Tung University, Department of Material Science and Engineering,Hsin-chu 300, Taiwan, Republic of China
Chih Chen*
Affiliation:
National Chiao Tung University, Department of Material Science and Engineering,Hsin-chu 300, Taiwan, Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Measurement of electromigration parameters in the lead-free solder SnAg3.5 was carried out by utilizing U-groove solder lines and atomic force microscopy in the temperature range of 100–150 °C. The drift velocity was measured, and the threshold current densities of the SnAg3.5 solder were estimated to be 4.4 × 104 A/cm2 at 100 °C, 3.3 × 104 A/cm2 at 125 °C, and 5.7 × 103 A/cm2 at 150 °C. These values represent the maximum current densities that the SnAg3.5 solder can carry without electromigration damage at the three stressing temperatures. The critical products for the SnAg3.5 solder were estimated to be 462 A/cm at 100 °C, 346 A/cm at 125 °C, and 60 A/cm at 150 °C. In addition, the electromigration activation energy was determined to be 0.55 eV in the temperature range of 100–150 °C. These values are very fundamental for current carrying capability and mean-time-to-failure measurement for solder bumps. This technique enables the direct measurement of electromigration parameters of solder materials.

Keywords

ElectromigrationPackaging
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 10 , October 2005 , pp. 2831 - 2837
Copyright
Copyright © Materials Research Society 2005

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References

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