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Investigation of vibration fracture behavior of Sn–Ag–Cu solders under resonance

Published online by Cambridge University Press:  03 March 2011

Jenn-Ming Song ,
Fang-I Li ,
Truan-Sheng Lui  and
Li-Hui Chen
Jenn-Ming Song
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
Fang-I Li
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
Truan-Sheng Lui
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
Li-Hui Chen
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
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Abstract

This study investigated the vibration fracture properties of Sn–Ag–Cu alloys with various Cu contents. Results show that the microstructure becomes finer with a higher Cu content. This leads to a lower damping capacity, higher deflection amplitude, and thus inferior vibration fracture resistance under a constant vibration force. It is of interest that when the Cu content reaches 1.5 wt%, the specimen possesses the highest damping capacity and greatest vibration life. The presence of massive primary Cu6Sn5 intermetallics probably accounts for this phenomenon.

Keywords

AlloyMicrostructureMechanical properties
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 9 , September 2004 , pp. 2665 - 2673
Copyright
Copyright © Materials Research Society 2004

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