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Interfacial-shear strength of the perfluorocyclobutane films on silicon

Published online by Cambridge University Press:  01 July 2006

Srinivasa Rao Boddapati ,
Hong Ma ,
Rajendra K. Bordia  and
Alex K-Y. Jen
Srinivasa Rao Boddapati*
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
Hong Ma
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
Rajendra K. Bordia
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
Alex K-Y. Jen
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, Washington 98195
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The debonding behavior of perfluorocyclobutane (PFCB) films on silicon (Si) has been investigated using Vickers indentation as a function of cure temperature and film thickness. PFCB films on Si were processed by spin coating (1–4 μm) and solution casting (20–60 μm). The interfacial shear strength of solution-cast PFCB films was independent of film thickness. The interfacial shear strength increased with cure temperature. The PFCB/Si cured at 225 °C exhibited interfacial shear strength of 123 MPa, and the strength increased to 163 MPa when the cure temperature was raised to 275 °C. The increase in interfacial-shear strength with temperature has been attributed to the increase in the density of bonds between PFCB and Si due to an increase in the density of crosslinks. Spin-coated films exhibited cracking due to the penetration of the indenter into the substrate, and the extent of cracking increased with the load.

Keywords

FilmPolymerStrength
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 7 , July 2006 , pp. 1759 - 1769
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

1.Ma, H., Jen, A.K-Y., Dalton, L.R.: Polymer-based optical waveguides: Materials, processing, and devices. Adv. Mater. 14, 1339 (2002).3.0.CO;2-O>CrossRefGoogle Scholar
2.Marshall, D.B., Evans, A.G.: Measurement of adherence of residually stressed thin films by indentation: (I) Mechanics of interface delamination. J. Appl. Phys. 56, 2632 (1984).CrossRefGoogle Scholar
3.Matthewson, M.J.: Axi-symmetric contact on thin compliant coatings. J. Mech. Phys. Solids 29(2), 89 (1981).CrossRefGoogle Scholar
4.Matthewson, M.J.: Adhesion measurement of thin films by indentation. Appl. Phys. Lett. 49, 1426 (1986).CrossRefGoogle Scholar
5.Conway, H.D., Thomsin, J.P.R.: The determination of bond strength of polymeric films by indentation debonding. J. Adhes. Sci. Technol. 2(2), 227 (1988).CrossRefGoogle Scholar
6.Ritter, J.E., Lardner, T.J., Rosenfeld, L., Lin, M.R.: Measurement of adhesion of thin polymer coatings by indentation. J. Appl. Phys. 66, 3626 (1989).CrossRefGoogle Scholar
7.Ritter, J.E., Rosenfeld, L.G.: Use of the indentation technique for studying delamination of polymeric coatings. J. Adhes. Sci. Technol. 4(7), 551 (1990).CrossRefGoogle Scholar
8.Jayachandran, R., Boyce, M.C., Argon, A.S.: Mechanics of the indentation test and its use to assess the adhesion of polymeric coatings. J. Adhes. Sci. Technol. 7(8), 813 (1993).CrossRefGoogle Scholar
9.Ritter, J.E., Sioui, D.R., Lardner, T.J.: Indentation behavior of polymer coatings on glass. Polymer Eng. Sci. 32(18), 1366 (1992).CrossRefGoogle Scholar
10.Tsui, T.Y., Pharr, G.M.: Substrate effects on nanoindentation mechanical property measurements of soft films on hard substrates. J. Mater. Res. 14, 292 (1999).CrossRefGoogle Scholar
11.Kramer, D.E., Volinsky, A.A., Moody, N.R., Gerberich, W.W.: Substrate effects on indentation plastic zone development in thin soft films. J. Mater. Res. 16, 3150 (2001).CrossRefGoogle Scholar
12.Li, M., Palacio, M.L., Carter, C.B., Gerberich, W.W.: Indentation deformation and fracture of thin polystyrene films. Thin Solid Films 416, 174 (2002).CrossRefGoogle Scholar
13.Liou, H-C., Ho, P.S., McKerrow, A.: The effect of crosslinking on thermal and mechanical properties of perfluorocyclobutane aromatic ether polymers. J. Polym. Sci. B: Polym. Phys. 36, 1383 (1998).3.0.CO;2-3>CrossRefGoogle Scholar
14.Low, I.M., Shi, C.: Vickers indentation responses of epoxy polymers. J. Mater. Sci. Lett. 17, 1181 (1998).CrossRefGoogle Scholar
15.Lange, J., Toll, S., Månson, J-A.E., Hult, A.: Residual stress build-up in thermoset films cured below their ultimate glass transition temperature. Polymer 38, 809 (1997).CrossRefGoogle Scholar
16.Townsend, P.H., Stokich, T.M. Jr., and Huber, B.S.: Mechanical behavior of benzocyclobutene films on silicon substrates, in Mechanical Behavior of Materials and Structures in Microelectronics, edited by Suhir, E., Cammarata, R.C., Chung, D.D.L., and Jono, M. (Mater. Res. Soc. Symp. Proc. 226, Pittsburgh, PA, 1991), p. 215.Google Scholar
17.Goldsmith, C., Geldermans, P., Bedetti, F., Walker, G.A.: Measurement of stresses generated in cured polyimide films. J. Vac. Sci. Technol. A 1(2), 407 (1983).CrossRefGoogle Scholar
18.Elsner, G.: Residual stress and thermal expansion of spun-on polyimide films. J. Appl. Polym. Sci. 34, 815 (1987).CrossRefGoogle Scholar
19.Swallowe, G.M.Mechanical Properties and Testing of Polymers (Kluwer Academic Publishers, Dordrecht, The Netherlands, 1999), p. 113.CrossRefGoogle Scholar
20.Stevens, M.J.: Interfacial fracture between highly cross-linked polymer networks and a solid: Effect of interfacial bond density. Macromolecules 34, 2710 (2001).CrossRefGoogle Scholar
21.Marsh, D.M.: Plastic flow in glass. Proc. R. Soc. London, A279, 420 (1964).Google Scholar
22.Lawn, B.: Fracture of Brittle Solids, 2nd ed. (Cambridge University Press, Cambridge, UK, 1993), p. 257.CrossRefGoogle Scholar