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Interfacial and twin boundary structures of nanostructured Cu–Ag filamentary composites

Published online by Cambridge University Press:  31 January 2011

K. H. Lee  and
S. I. Hong
K. H. Lee
Affiliation:
Department of Metallurgical Engineering, Chungnam National University, Taedok Science Town, Taejon 305–764, Korea
S. I. Hong*
Affiliation:
Department of Metallurgical Engineering, Chungnam National University, Taedok Science Town, Taejon 305–764, Korea
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

A high-resolution transmission electron microscope was used to study the interfacial and twin boundary structure of nanostructured Cu–Ag filamentary composites. Copper matrix and silver filaments have the orientation relationship {111}Cu∥{111}Ag and 〈111〉Cu∥〈111〉Ag. In some regions, twin bands propagated through the silver filaments with some boundary steps at the matrix/filament interface, and the silver filament appeared to be kinked in the twin band in the same direction as the twinning shear. This suggests that twins propagated after the formation of silver filament, and twin bands were deformation twins. At the matrix/filament interface, misfit interface dislocations were introduced periodically to relieve the misfit strain. The distance between interfacial misfit dislocations along the matrix/filament interface in the longitudinal section was measured to be 1.88 nm, which is in good agreement with that (1.81 nm) calculated based on lattice misfit. In Cu–Ag nanocomposites, the spacing between Moire fringes was found to be quite close to that between interfacial misfit dislocations.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 9 , September 2003 , pp. 2194 - 2202
Copyright
Copyright © Materials Research Society 2003

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