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Initial interfacial reaction layers formed in Sn–3.5Ag solder/electroless Ni–P plated Cu substrate system

Published online by Cambridge University Press:  31 January 2011

Han-Byul Kang ,
Jae-Wook Lee ,
Jee-Hwan Bae ,
Min-Ho Park ,
Jeong-Won Yoon ,
Seung-Boo Jung ,
Jae-Seon Ju  and
Cheol-Woong Yang
Han-Byul Kang
Affiliation:
School of Advanced Materials Science & Engineering and Center for Nanotubes & Nanostructured Composites, Sungkyunkwan University, Suwon 440-746, South Korea
Jae-Wook Lee
Affiliation:
School of Advanced Materials Science & Engineering and Center for Nanotubes & Nanostructured Composites, Sungkyunkwan University, Suwon 440-746, South Korea
Jee-Hwan Bae
Affiliation:
School of Advanced Materials Science & Engineering and Center for Nanotubes & Nanostructured Composites, Sungkyunkwan University, Suwon 440-746, South Korea
Min-Ho Park
Affiliation:
School of Advanced Materials Science & Engineering and Center for Nanotubes & Nanostructured Composites, Sungkyunkwan University, Suwon 440-746, South Korea
Jeong-Won Yoon
Affiliation:
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 440-746, South Korea
Seung-Boo Jung
Affiliation:
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon 440-746, South Korea
Jae-Seon Ju
Affiliation:
Cooperative Center for Research Facilities, Sungkyunkwan University, Suwon 440-746, South Korea
Cheol-Woong Yang*
Affiliation:
School of Advanced Materials Science & Engineering and Center for Nanotubes & Nanostructured Composites, Sungkyunkwan University, Suwon 440-746, South Korea
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Analytical electron microscopy (AEM) was used to examine the initial interfacial reaction layers between a eutectic Sn–3.5Ag solder and an electroless nickel-immersion gold-plated (ENIG) Cu substrate during reflow at 255 °C for 1 s. AEM confirmed that a thick upper (Au,Ni)Sn2 layer and a thin Ni3Sn4 layer had formed through the reaction between the solder and ENIG. The amorphous electroless Ni(P) plated layer transformed into two P-rich Ni layers. One is a crystallized P-rich Ni layer, and the other is an intermediate state P-rich Ni layer before the crystallization. The crystallized P-rich layer consisted of Ni2P and Ni12P5. A thin Ni2P layer had formed underneath the Ni3Sn4 layer and is believed to be a predecessor of the Ni2SnP ternary phase. A Ni12P5 phase was observed beneath the Ni2P thin layer. In addition, nanocrystalline Ni was found to coexist with the amorphous Ni(P) phase in the intermediate state P-rich Ni layer.

Keywords

PackagingSolderingTransmission electron microscopy (TEM)
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 8 , August 2008 , pp. 2195 - 2201
Copyright
Copyright © Materials Research Society 2008

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