Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Guyer, Eric P.
Gantz, Jay
and
Dauskardt, Reinhold H.
2007.
Aqueous solution diffusion in hydrophobic nanoporous thin-film glasses.
Journal of Materials Research,
Vol. 22,
Issue. 3,
p.
710.
Kearney, Andrew V.
Vairagar, Anand V.
Geisler, Holm
Zschech, Ehrenfried
and
Dauskardt, Reinhold H.
2007.
Assessing the Effect of Die Sealing in Cu/Low-k Structures.
p.
138.
Yeap, Kong Boon
Zeng, Kaiyang
Jiang, Haiyan
Shen, Lu
and
Chi, Dongzhi
2007.
Determining interfacial properties of submicron low-k films on Si substrate by using wedge indentation technique.
Journal of Applied Physics,
Vol. 101,
Issue. 12,
Dubois, G.
Volksen, W.
Magbitang, T.
Miller, R. D.
Gage, D. M.
and
Dauskardt, R. H.
2007.
Molecular Network Reinforcement of Sol–Gel Glasses.
Advanced Materials,
Vol. 19,
Issue. 22,
p.
3989.
Kim, Taek-Soo
Zhong, Qiping
Peterson, Maria
Tam, Halbert
Konno, Tomohisa
and
Dauskardt, Reinhold H.
2007.
Stress and Slurry Chemistry Effects on CMP Damage of Ultra-Low-k Dielectrics.
p.
129.
Eslava, Salvador
Iacopi, F.
Urbanowicz, A. M.
Kirschhock, Christine E. A.
Maex, Karen
Martens, Johan A.
and
Baklanov, Mikhail R.
2008.
Ultraviolet-Assisted Curing of Organosilicate Glass Low-k Dielectric by Excimer Lamps.
Journal of The Electrochemical Society,
Vol. 155,
Issue. 11,
p.
G231.
Kim, Taek-Soo
Tsuji, Naoto
Matsushita, Kiyohiro
Kobayashi, Nobuyoshi
Chumakov, Dmytro
Geisler, Holm
Zschech, Ehrenfried
and
Dauskardt, Reinhold H.
2008.
Tuning depth profiles of organosilicate films with ultraviolet curing.
Journal of Applied Physics,
Vol. 104,
Issue. 7,
Han, Aijie
Punyamurthula, Venkata K.
Lu, Weiyi
and
Qiao, Yu
2008.
Deformation of a nanoporous silica under compressive loading.
Journal of Applied Physics,
Vol. 103,
Issue. 8,
Ong, Markus D.
Volksen, Willi
Dubois, Geraud
Lee, Victor
Brock, Phillip J.
Deline, Vaughn R.
Miller, Robert D.
and
Dauskardt, Reinhold H.
2008.
Molecular‐Controlled Fracture and Release of Templated Nanoporous Organosilicate Thin Films.
Advanced Materials,
Vol. 20,
Issue. 16,
p.
3159.
Yeap, Kong Boon
Zeng, Kaiyang
and
Chi, Dongzhi
2008.
Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies.
Acta Materialia,
Vol. 56,
Issue. 5,
p.
977.
Gage, David M.
Kim, Kyunghoon
Litteken, Christopher S.
and
Dauskardt, Reinhold H.
2008.
Role of friction and loading parameters in four-point bend adhesion measurements.
Journal of Materials Research,
Vol. 23,
Issue. 1,
p.
87.
Lin, Youbo
Xiang, Yong
Tsui, Ting Y.
and
Vlassak, Joost J.
2008.
PECVD low-permittivity organosilicate glass coatings: Adhesion, fracture and mechanical properties.
Acta Materialia,
Vol. 56,
Issue. 17,
p.
4932.
Dubois, Geraud
Volksen, Willi
Magbitang, Teddie
Sherwood, Mark H.
Miller, Robert D.
Gage, David M.
and
Dauskardt, Reinhold H.
2008.
Superior mechanical properties of dense and porous organic/inorganic hybrid thin films.
Journal of Sol-Gel Science and Technology,
Vol. 48,
Issue. 1-2,
p.
187.
Kearney, Andrew V.
Litteken, Christopher S.
Mohler, Carol E.
Mills, Michael E.
and
Dauskardt, Reinhold H.
2008.
Pore size scaling for enhanced fracture resistance of nanoporous polymer thin films.
Acta Materialia,
Vol. 56,
Issue. 20,
p.
5946.
Gage, David M.
Stebbins, Jonathan F.
Peng, Luming
Cui, Zhenjiang
Al-Bayati, Amir
MacWilliams, Kenneth P.
M’Saad, Hichem
and
Dauskardt, Reinhold H.
2008.
Effects of UV cure on glass structure and fracture properties of nanoporous carbon-doped oxide thin films.
Journal of Applied Physics,
Vol. 104,
Issue. 4,
Yeap, Kong Boon
Zeng, Kaiyang
and
Chi, Dongzhi
2009.
Wedge indentation studies of low-k films at inert, water and ambient environments.
Materials Science and Engineering: A,
Vol. 518,
Issue. 1-2,
p.
132.
Taek-Soo Kim
and
Dauskardt, R.H.
2009.
Integration Challenges of Nanoporous Low Dielectric Constant Materials.
IEEE Transactions on Device and Materials Reliability,
Vol. 9,
Issue. 4,
p.
509.
Li, Han
Tsui, Ting Y.
and
Vlassak, Joost J.
2009.
Water diffusion and fracture behavior in nanoporous low-k dielectric film stacks.
Journal of Applied Physics,
Vol. 106,
Issue. 3,
Freiman, Stephen W.
Wiederhorn, Sheldon M.
and
Mecholsky, Jr., John J.
2009.
Environmentally Enhanced Fracture of Glass: A Historical Perspective.
Journal of the American Ceramic Society,
Vol. 92,
Issue. 7,
p.
1371.
Gandhi, D. D.
Singh, B.
Singh, A. P.
Moore, R.
Simonyi, E.
Lane, M. W.
and
Ramanath, G.
2009.
Effects of silylation on fracture and mechanical properties of mesoporous silica films interfaced with copper.
Journal of Applied Physics,
Vol. 106,
Issue. 5,