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Formation of Mg–Mg2Cu nanostructured eutectic in Mg-based metal matrix composite

Published online by Cambridge University Press:  31 January 2011

N. G. Ma
Affiliation:
Department of Physics, The Chinese University of Hong Kong, Shatin, Hong Kong, People's Republic of China
C. J. Deng
Affiliation:
Department of Physics, The Chinese University of Hong Kong, Shatin, Hong Kong, People's Republic of China
P. Yu
Affiliation:
Department of Physics, The Chinese University of Hong Kong, Shatin, Hong Kong, People's Republic of China
W. Y. Kwok
Affiliation:
Department of Physics, The Chinese University of Hong Kong, Shatin, Hong Kong, People's Republic of China
M. Aravind
Affiliation:
Department of Physics, The Chinese University of Hong Kong, Shatin, Hong Kong, People's Republic of China
D. H. L. Ng
Affiliation:
Department of Physics, The Chinese University of Hong Kong, Shatin, Hong Kong, People's Republic of China
S. L. I. Chan
Affiliation:
Department of Materials Science and Engineering, National Taiwan University, Taiwan, Republic of China
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Abstract

We report the fabrication and characterization of a Mg-based metal matrix composite reinforced by MgO ceramic and Mg–Mg2Cu eutectic. The composite was fabricated by sintering and quenching of a Mg–20 wt.% CuO sample. We performed differential scanning calorimetry (DSC) on the sample and found that the reaction between Mg and CuO took place at about 420 °C. When the sample was sintered to 550 °C and cooled down, the two-phase Mg–Mg2 Cu eutectic formed. The final composite product contained MgO particles and Mg–Mg2Cu eutectic, which were embedded in the Mg matrix. Based on the results from DSC and scanning and transmission electron microscopies, a model is proposed to describe the competitive growth of Mg and the eutectic during solidification. We also found that the microstructure of the Mg–Mg2 Cu eutectic strongly depended on the rate of cooling. The lamellar thickness of the eutectic could be reduced to 120 nm by oil-quenching the sintered sample.

Type
Articles
Copyright
Copyright © Materials Research Society 2003

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