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Extrusion of superconducting wires of YBa2Cu3O7−x

Published online by Cambridge University Press:  31 January 2011

D. Ponnusamy  and
K. Ravi-Chandar
D. Ponnusamy
Affiliation:
Texas Center for Superconductivity and Department of Mechanical Engineering, University of Houston, Houston, Texas 77204-4792
K. Ravi-Chandar
Affiliation:
Texas Center for Superconductivity and Department of Mechanical Engineering, University of Houston, Houston, Texas 77204-4792
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Abstract

High Tc superconductors need to be fabricated into desirable configurations such as wires for practical applications. Toward this objective, the plastic extrusion process was applied to the fabrication of wires and rods of YBa2Cu3O7−x. The ceramic oxide powder is combined with several organic additives to form a slurry which is extruded by forcing it through a small aperture. This is subjected to a sequence of heat treatments for drying, binder burn-out, and sintering. The critical current density of these wires ranges from 800 A/cm2 to 1500 A/cm2 depending upon the diameter and the current-carrying capacity is uniform over long lengths of up to 140 cm. This process was also applied to fabrication of larger cross-sectional area rods and hollow cylinders, capable of carrying up to 245 A. The mechanical properties of these wires were also investigated.

Type
Articles
Information
Journal of Materials Research , Volume 8 , Issue 2 , February 1993 , pp. 268 - 273
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1Jin, S.Sherwood, R.C. R. B. van Dover, Tiefel, T.H. and Johnson, D.W. Jr. , Appl. Phys. Lett. 51, 203 (1987).Google Scholar
2Lanagan, M. T.Poeppel, R. B.Singh, J. P.Santos, D. I. Dos, Lumpp, J. K.Balachandran, U.Dusek, J. T. and Goretta, K. C.J. Less-Comm. Met. 149, 305 (1989).CrossRefGoogle Scholar
3Su, S. R.OConnor, M., Levinson, M. and Rossoni, P.G.Physica C 178, 81 (1991).CrossRefGoogle Scholar
4Woolf, L.D.Raggio, W.A.Eisner, F.E.Fisher, M.V.Stephens, R.B.Figueroa, T.L.Shearer, C.H.Rose, J.D.Schaubel, K.M.Olstad, R. A.Ohkawa, T.Duggan, D. M.DiMartino, M. and Fagaly, R. L.Appl. Phys. Lett. 58, 534 (1991).CrossRefGoogle Scholar
5Shimizu, H.Kumakura, H. and Togano, K.Jpn. J. Appl. Phys. 27, L414 (1988).Google Scholar
6Reed, J. S.Principles of Ceramic Processing (John Wiley, New York, 1988).Google Scholar
7Onoda, G. Y. and Hench, L. L. The Rheology of Organic Binder Solutions in Ceramic Processing Before Firing, edited by Onoda, G. Y. (John Wiley, New York, 1978).Google Scholar
8Kingery, W. D.Bowen, H. K. and Uhlmann, D. R.Introduction to Ceramics (John Wiley Sons, New York, 1976).Google Scholar
9Bransky, I. and Bransky, J.J. Appl. Phys. 66, 5510 (1989).CrossRefGoogle Scholar
10Meng, R. L.Sun, Y. Y.Hor, P. H. and Chu, C. W.Physica C 179, 149 (1991).CrossRefGoogle Scholar
11Selvamanickam, V.Partsinevelos, C.McGuire, A. V. and Salama, K., Appl. Phys. Lett., 60, 3313 (1992).CrossRefGoogle Scholar
12Ochai, S.Hayashi, K.Osamura, K. and Hosoda, A.J. Mater. Sci. Lett. 10, 117 (1990).Google Scholar
13Ihm, M.K.Powell, B.R. and Bloink, R.L.J. Mater. Sci. 25, 1664 (1990).CrossRefGoogle Scholar
14Yeh, F. and White, K.W.J. Appl. Phys. 70, 4989 (1991).CrossRefGoogle Scholar