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Extraordinary adhesion of a simple niobium metal-bonding structure

Published online by Cambridge University Press:  03 March 2011

H.S. Chen ,
D.D. Bacon ,
H.H. Law ,
G.W. Kammlott  and
T.C. Wu
H.S. Chen
Affiliation:
AT&T Bell Laboratories, Murray Hill New Jersey 07974
D.D. Bacon
Affiliation:
AT&T Bell Laboratories, Murray Hill New Jersey 07974
H.H. Law
Affiliation:
AT&T Bell Laboratories, Murray Hill New Jersey 07974
G.W. Kammlott
Affiliation:
AT&T Bell Laboratories, Murray Hill New Jersey 07974
T.C. Wu
Affiliation:
AT&T Bell Laboratories, Murray Hill New Jersey 07974
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Abstract

Extraordinary adhesion of a Nb-based/Au-Sn metallization structure on a SiO2/Si substrate has been observed by a tensile pull test. The metallization bond fails mostly via fracture through either the Si substrate or epoxy adhesive. The intrinsic adhesion pull strength of the metallization scheme is concluded to be greater than 10 kpsi, and the adhesion exceeds the Si-Si cohesive strength. The Nb-Si and Nb-O bonds at the interface are thermodynamically stable.

Type
Articles
Information
Journal of Materials Research , Volume 10 , Issue 11 , November 1995 , pp. 2870 - 2874
Copyright
Copyright © Materials Research Society 1995

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References

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