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Electrical performance and reaction kinetics of silicone gels

Published online by Cambridge University Press:  31 January 2011

C.P. Wong
C.P. Wong
Affiliation:
AT & T Bell Laboratories, P.O. Box 900, Princeton, New Jersey 08540
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Abstract

Silicone gels are becoming more accepted as protective coatings for Very Large Scale Integrated circuits (VLSI) against severe environments due to their excellent electrical, thermal, and mechanical properties. Recent studies indicate that high performance silicone gels in low-cost, non-hermetic plastic packaging may replace conventional hermetic ceramic packaging. This paper describes the use of the soft silicone gels as coatings on Integrated Circuit (IC) devices, and the correlation between the material's cure temperature and cure time versus their adhesion and electrical reliability during 85°C, 85% RH and bias accelerating testing. In addition, the reaction kinetics of the silicone gel based on the Differential Scanning Calorimetry (DSC) study of the uncured sample will be reported.

Type
Articles
Information
Journal of Materials Research , Volume 5 , Issue 4 , April 1990 , pp. 795 - 800
Copyright
Copyright © Materials Research Society 1990

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References

REFERENCES

1VLSI Technology, edited by Sze, S. M. (McGraw-Hill, New York, 1983).Google Scholar
2Wong, C. P., Advances in Polymer Science (Springer-Verlag, 1988), Vol. 84, pp. 63–83.Google Scholar
3Wong, C. P., in The Encyclopedia of Polymer Science and Engineering (John Wiley and Sons, New York, 1986), 2nd ed., Vol. 5, p. 638.Google Scholar
4Wong, C. P., in Polymers for Electronic Applications (CRC Press, Boca Raton, FL, 1989), pp. 63–92.Google Scholar
5Otsuka, K., Shirai, Y., and Okutani, K., IEEE Transactions on Components, Hybrids, and Manufacturing Technology CHMT-7 (3), 249 (1984).CrossRefGoogle Scholar
6Wong, C.P., Electronic Packaging Materials Science III (Proc. Mater. Res. Soc. Symp.) (Materials Research Society, Pittsburgh, PA, 1988), Vol. 108, p. 175.Google Scholar
7Noll, W., Chemistry and Technology of Silicones (Academic Press, New York, 1968).Google Scholar
8Wong, C. P., Polymer Science and Engineering Proceedings (American Chemical Society, 1986), Vol. 55, p. 803.Google Scholar
9Borchardt, H. J. and Daniels, F. J., J. Am. Chem. Soc. 79, 41 (1956).CrossRefGoogle Scholar
10Wong, C. P., Segelken, J. M., and Balde, J.W., IEEE Trans, on Components, Hybrids, and Manufacturing Technology 12 (4), 419 (1989).CrossRefGoogle Scholar
11Wong, C. P., Patent, U.S. 4810768 (March 7, 1989).Google Scholar