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Effects of process history and aging on the properties of polyimide films

Published online by Cambridge University Press:  31 January 2011

Denice D. Denton ,
Milan C. Buncick  and
Hartono Pranjoto
Denice D. Denton
Affiliation:
Department of Electrical and Computer Engineering and Materials Science Program, University of Wisconsin–Madison, 1415 Johnson Drive, Madison, Wisconsin 53706
Milan C. Buncick
Affiliation:
Department of Electrical and Computer Engineering and Materials Science Program, University of Wisconsin–Madison, 1415 Johnson Drive, Madison, Wisconsin 53706
Hartono Pranjoto
Affiliation:
Department of Electrical and Computer Engineering and Materials Science Program, University of Wisconsin–Madison, 1415 Johnson Drive, Madison, Wisconsin 53706
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Abstract

Polyimide is used extensively in a variety of integrated circuit packaging applications. It is a good dielectric material with excellent planarizing capabilities, but like most polymers, it absorbs moisture. This hygroscopic behavior can lead to reliability problems in integrated circuit packages. The effects of variations in process history on moisture uptake are examined using gravimetric measurement techniques. In particular, the effects of cure schedule and exposure to high temperature/high humidity environments (85 °C/85% RH) on steady state moisture uptake are reported. Steady state moisture uptake is shown to be a decreasing function of cure temperature. Samples cured at 250 °C absorb 25% more moisture by weight than do samples cured at 400 °C. Moreover, the steady state moisture uptake in polyimide is greater after the samples have been “aged” in a high temperature and humidity ambient. The bulk and surface chemical composition are also monitored as a function of aging using Fourier transform infrared spectroscopy (FTIR) and electron spectroscopy for chemical analysis (ESCA), respectively. The PI surface chemistry degrades after 700 h in an 85 °C/85% RH environment. The bulk chemical composition appears to be unaffected.

Type
Articles
Information
Journal of Materials Research , Volume 6 , Issue 12 , December 1991 , pp. 2747 - 2754
Copyright
Copyright © Materials Research Society 1991

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