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Effects of Creep and Thermal Drift on Modulus Measurement Using Depth-sensing Indentation

Published online by Cambridge University Press:  31 January 2011

G. Feng  and
A. H. W. Ngan
G. Feng
Affiliation:
Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong, Peoples’ Republic of China
A. H. W. Ngan
Affiliation:
Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong, Peoples’ Republic of China
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Abstract

In modulus measurement by depth-sensing indentation, previous considerations assume elastic recovery to be the sole process during unloading, but in reality creep and thermal drift may also occur, causing serious errors in the measured modulus. In this work, the problem of indentation on a linear viscoelastic half-space is solved using the correspondence principle between elasticity and linear viscoelasticity. The correction term due to creep in the apparent contact compliance is found to be equal to the ratio of the indenter displacement rate at the end of the load hold to the unloading rate. A condition for nullifying the effect of thermal drift on modulus measurement is also proposed. With this condition satisfied, the effect of thermal drift on the calculated modulus is negligible irrespective of the magnitude of the drift rate.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 3 , March 2002 , pp. 660 - 668
Copyright
Copyright © Materials Research Society 2002

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References

Pethica, J.B., Hutchings, R., and Oliver, W.C., Philos. Mag. A 48, 593 (1983).CrossRefGoogle Scholar
Doerner, M.F. and Nix, W.D., J. Mater. Res. 1, 601 (1986).CrossRefGoogle Scholar
Pharr, G.M., Oliver, W.C., and Brotzen, F.R., J. Mater. Res. 7, 613 (1992).CrossRefGoogle Scholar
Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7, 1564 (1992).CrossRefGoogle Scholar
Lo, R.Y. and Bogy, D.B., J. Mater. Res. 14, 2276 (1999).CrossRefGoogle Scholar
Hay, J.C., Bolshakov, A., and Pharr, G.M., J. Mater. Res. 14, 2296 (1999).CrossRefGoogle Scholar
Hill, R., Proc. R. Soc. Lond. A 436, 617 (1992).Google Scholar
Bower, A.F., Fleck, N.A., Needleman, A., and Ogbonna, N., Proc. R. Soc. Lond. A 441, 97 (1993).Google Scholar
Radok, J.R.M., Q. App. Math. 15, 198 (1957).CrossRefGoogle Scholar
Lee, E.H. and Radok, J.R.M., J. App. Mech. 27, 438 (1960).CrossRefGoogle Scholar
Ting, T.C.T., J. App. Mech. 33, 845 (1966).CrossRefGoogle Scholar
Sneddon, I.N., Int. J. Engng. Sci. 3, 47 (1965).CrossRefGoogle Scholar
Vlassak, J.J. and Nix, W.D., J. Mech. Phys. Solids. 42, 1223 (1994).CrossRefGoogle Scholar