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Effect of nitrogen flow ratio on the microstructure evolution and nanoindented mechanical property of the Ta–Si–N thin films

Published online by Cambridge University Press:  31 January 2011

C.K. Chung  and
T.S. Chen
C.K. Chung*
Affiliation:
Department of Mechanical Engineering, Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
T.S. Chen
Affiliation:
Department of Mechanical Engineering, Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The relations among the process, microstructure, and nanomechanical properties of cosputtered Ta–Si–N thin films have been investigated. The microstructure evolution and varied hardness and elastic modulus property of Ta–Si–N were influenced by nitrogen flow ratios [FN2% = FN2/(Far + FN2) × 100%] during cosputtering together with phase formation and the composition of films. The microstructure of Ta–Si–N formed at a low 2–10 FN2% was an amorphous-like phase with nanocrystalline grains embedded in an amorphous matrix, while polycrystalline Ta–Si–N was obtained at a high 20–30 FN2%. The cubic TaN phase or (Ta1–x,Six)N solid solution is much easier to form polycrystallites than noncubic Ta5Si3, Ta2Si, and Ta2N phases from grazing incidence x-ray diffractometry results. Amorphous-like Ta–Si–N films had much higher nanohardness, stiffness, elastic recovery percentage, and a closer boundary compared to polycrystalline films. A maximum nanohardness of 15.2 GPa was obtained at 3 FN2%. An increased hardness of polycrystalline films at 20–30 FN2% is attributed to the higher amount of the hard TaN phase.

Keywords

HardnessMicrostructurePhysical vapor deposition (PVD)
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 2 , February 2008 , pp. 494 - 499
Copyright
Copyright © Materials Research Society 2007

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