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Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

Published online by Cambridge University Press:  31 January 2011

Yee-wen Yen  and
Wei-kai Liou
Yee-wen Yen*
Affiliation:
Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China
Wei-kai Liou
Affiliation:
Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei 10672, Taiwan, Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

This study investigates interfacial reactions of (Sn–9Zn) + xCu/Ni systems. Ni5Zn21, Cu5Zn8, (Ni,Zn,Cu)3Sn4, (Cu,Ni,Zn)6Sn5, and Cu6Sn5 phases were formed on the Sn–9Zn/Ni interface at 240–270 °C, when 0–10 wt% Cu was added to the Sn–9Zn solder. Experimental results indicate that changing the concentration of Cu in the Sn–9Zn solder dramatically changes the formation of intermetallic compounds (IMCs) in the (Sn–9Zn) + xCu/Ni system. Different diffusion and segregation rates of elements are the main reasons for a change in the IMC evolution.

Keywords

DiffusionPackagingSoldering
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 10 , October 2007 , pp. 2663 - 2667
Copyright
Copyright © Materials Research Society 2007

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References

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