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Deformation characteristics of tin-based solder joints

Published online by Cambridge University Press:  03 March 2011

Antonia Antoniou  and
Ashraf F. Bastawros
Antonia Antoniou
Affiliation:
Department of Aerospace Engineering and Engineering Mechanics, Iowa State University, Ames, Iowa 50011
Ashraf F. Bastawros*
Affiliation:
Department of Aerospace Engineering and Engineering Mechanics, Iowa State University, Ames, Iowa 50011
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

A novel experimental configuration was devised to measure the evolution of the deformation field and the corresponding toughness in solder joints for microelectronic packaging. The utilized material system comprised a ductile layer of tin-based solder encapsulated within relatively hard copper shoulders. The experimental configuration provided pure shear state within the constrained solder layer. Different Pb/Sn compositions were tested with grain size approaching the film thickness. The in-plane strain distribution within the joint thickness was measured by a microscopic digital image correlation system. The toughness evolution within such highly gradient deformation field was monitored qualitatively through a two-dimensional surface scan with a nanoindentor. The measurements showed a highly inhomogeneous deformation field within the film with discreet shear bands of concentrated strain. The localized shear bands showed long-range correlations of the order 2–3 grain diameters. A size-dependent macroscopic response on the layer thickness was observed. However, the corresponding film thickness was approximately 100–1000 times larger than those predicted by nonlocal continuum theories and discreet dislocation.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 10 , October 2003 , pp. 2304 - 2309
Copyright
Copyright © Materials Research Society 2003

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