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Cumulative shear strain–induced preferential orientation during abnormal grain growth near fatigue crack tips of nanocrystalline Au films

Published online by Cambridge University Press:  13 January 2020

Si-Xue Zheng ,
Xue-Mei Luo Open the ORCID record for Xue-Mei Luo [Opens in a new window]  and
Guang-Ping Zhang Open the ORCID record for Guang-Ping Zhang [Opens in a new window]
Si-Xue Zheng
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; and School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China
Xue-Mei Luo*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Guang-Ping Zhang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
*
a)Address all correspondence to these authors. e-mail: [email protected]
b)e-mail: [email protected]
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Abstract

A detailed electron backscatter diffraction (EBSD) characterization was utilized to investigate abnormal grain growth behavior of nanocrystalline (NC) Au films constrained by a flexible substrate under cyclic loading. Abnormally grown grains (AGGs) in front of about 15 fatigue cracks were picked out to investigate the grain reorientation behavior during abnormal grain growth in the fatigue crack tip in the cyclically deformed thin films. It shows that the AGGs exhibited 〈001〉 orientation along the loading direction, whereas grains grown far away from fatigue cracks had no significant texture change. The cyclic cumulative shear strain was found to play a key role in grain reorientation. A lattice rotation model was proposed to elucidate the grain reorientation mechanism during abnormal grain growth. Such grain reorientation behavior of NC metals was found to provide an intrinsic resistance of the NC metals to fatigue damage.

Keywords

fatiguegrain sizetexturenanocrystallinegrain growth
Type
Article
Information
Journal of Materials Research , Volume 35 , Issue 4 , 28 February 2020 , pp. 372 - 379
Copyright
Copyright © Materials Research Society 2020

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References

Schiotz, J. and Jacobsen, K.W.: A maximum in the strength of nanocrystalline copper. Science 301, 1357 (2003).CrossRefGoogle ScholarPubMed
Mughrabi, H. and Höppel, H.W.: Cyclic deformation and fatigue properties of very fine-grained metals and alloys. Int. J. Fatigue 32, 1413 (2010).CrossRefGoogle Scholar
Wang, L., Teng, J., Liu, P., Hirata, A., Ma, E., Zhang, Z., Chen, M., and Han, X.: Grain rotation mediated by grain boundary dislocations in nanocrystalline platinum. Nat. Commun. 5, 4402 (2014).CrossRefGoogle ScholarPubMed
Gianola, D.S., Van Petegem, S., Legros, M., Brandstetter, S., Van Swygenhoven, H., and Hemker, K.J.: Stress-assisted discontinuous grain growth and its effect on the deformation behavior of nanocrystalline aluminum thin films. Acta Mater. 54, 2253 (2006).CrossRefGoogle Scholar
Minor, A.M., Lilleodden, E.T., Stach, E.A., and Morris, J.W.: Direct observations of incipient plasticity during nanoindentation of Al. J. Mater. Res. 19, 176 (2004).CrossRefGoogle Scholar
Meirom, R.A., Alsem, D.H., Romasco, A.L., Clark, T., Polcawich, R.G., Pulskamp, J.S., Dubey, M., Ritchie, R.O., and Muhlstein, C.L.: Fatigue-induced grain coarsening in nanocrystalline platinum films. Acta Mater. 59, 1141 (2011).CrossRefGoogle Scholar
Kapp, M.W., Kremmer, T., Motz, C., Yang, B., and Pippan, R.: Structural instabilities during cyclic loading of ultrafine-grained copper studied with micro bending experiments. Acta Mater. 125, 351 (2017).CrossRefGoogle Scholar
Zhang, K., Weertman, J.R., and Eastman, J.A.: Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures. Appl. Phys. Lett. 87, 061921 (2005).CrossRefGoogle Scholar
Höppel, H.W., Zhou, Z.M., Mughrabi, H., and Valiev, R.Z.: Microstructural study of the parameters governing coarsening and cyclic softening in fatigued ultrafine-grained copper. Philos. Mag. A 82, 1781 (2002).CrossRefGoogle Scholar
Glushko, O. and Cordill, M.J.: The driving force governing room temperature grain coarsening in thin gold films. Scr. Mater. 130, 42 (2017).CrossRefGoogle Scholar
Luo, X-M., Li, X., and Zhang, G-P.: Forming incoherent twin boundaries: A new way for nanograin growth under cyclic loading. Mater. Res. Lett. 5, 95 (2017).CrossRefGoogle Scholar
Luo, X.M., Zhu, X.F., and Zhang, G.P.: Nanotwin-assisted grain growth in nanocrystalline gold films under cyclic loading. Nat. Commun. 5, 3021 (2014).CrossRefGoogle ScholarPubMed
Boyce, B.L. and Padilla, H.A.: Anomalous fatigue behavior and fatigue-induced grain growth in nanocrystalline nickel alloys. Metall. Mater. Trans. A 42, 1793 (2011).CrossRefGoogle Scholar
Shan, Z.W.: Grain boundary-mediated plasticity in nanocrystalline nickel. Science 305, 654 (2004).CrossRefGoogle ScholarPubMed
Soer, W.A., De Hosson, J.T.M., Minor, A.M., Morris, J.W. Jr., and Stach, E.A.: Effects of solute Mg on grain boundary and dislocation dynamics during nanoindentation of Al–Mg thin films. Acta Mater. 52, 5783 (2004).CrossRefGoogle Scholar
Fan, G.J., Fu, L.F., Choo, H., Liaw, P.K., and Browning, N.D.: Uniaxial tensile plastic deformation and grain growth of bulk nanocrystalline alloys. Acta Mater. 54, 4781 (2006).CrossRefGoogle Scholar
Padilla, H.A. and Boyce, B.L.: A review of fatigue behavior in nanocrystalline metals. Exp. Mech. 50, 5 (2009).CrossRefGoogle Scholar
Cheng, S., Zhao, Y.H., Wang, Y.M., Li, Y., Wang, X.L., Liaw, P.K., and Lavernia, E.J.: Structure modulation driven by cyclic deformation in nanocrystalline NiFe. Phys. Rev. Lett. 104, 255501 (2010).CrossRefGoogle ScholarPubMed
Fan, G.J., Fu, L.F., Qiao, D.C., Choo, H., Liaw, P.K., and Browning, N.D.: Grain growth in a bulk nanocrystalline Co alloy during tensile plastic deformation. Scr. Mater. 54, 2137 (2006).CrossRefGoogle Scholar
Furnish, T.A., Boyce, B.L., Sharon, J.A., O'Brien, C.J., Clark, B.G., Arrington, C.L., and Pillars, J.R.: Fatigue stress concentration and notch sensitivity in nanocrystalline metals. J. Mater. Res. 31, 740 (2016).CrossRefGoogle Scholar
Long, J.Z., Pan, Q.S., Tao, N.R., and Lu, L.: Abnormal grain coarsening in cyclically deformed gradient nanograined Cu. Scr. Mater. 145, 99 (2018).CrossRefGoogle Scholar
Kondo, T., Bi, X., Hirakata, H., and Minoshima, K.: Mechanics of fatigue crack initiation in submicron-thick freestanding copper films. Int. J. Fatigue 82, 12 (2016).CrossRefGoogle Scholar
Zheng, S.X., Luo, X.M., Wang, D., and Zhang, G.P.: A novel evaluation strategy for fatigue reliability of flexible nanoscale films. Mater. Res. Express 5, 035012 (2018).CrossRefGoogle Scholar
Luo, X.M. and Zhang, G.P.: Grain boundary instability dependent fatigue damage behavior in nanoscale gold films on flexible substrates. Mater. Sci. Eng., A 702, 81 (2017).CrossRefGoogle Scholar
Han, S.Z., Goto, M., Ahn, J-H., Lim, S.H., Kim, S., and Lee, J.: Grain growth in ultrafine grain sized copper during cyclic deformation. J. Alloys Compd. 615, S587 (2014).CrossRefGoogle Scholar
Hoppel, H., Kautz, M., Xu, C., Murashkin, M., Langdon, T., Valiev, R., and Mughrabi, H.: An overview: Fatigue behaviour of ultrafine-grained metals and alloys. Int. J. Fatigue 28, 1001 (2006).CrossRefGoogle Scholar
Kobayashi, S., Kamata, A., and Watanabe, T.: A mechanism of grain growth-assisted intergranular fatigue fracture in electrodeposited nanocrystalline nickel–phosphorus alloy. Acta Mater. 91, 70 (2015).CrossRefGoogle Scholar
Glushko, O. and Dehm, G.: Initiation and stagnation of room temperature grain coarsening in cyclically strained gold films. Acta Mater. 169, 99 (2019).CrossRefGoogle Scholar
Zhao, P., Chen, B., Kelleher, J., Yuan, G., Guan, B., Zhang, X., and Tu, S.: High-cycle-fatigue induced continuous grain growth in ultrafine-grained titanium. Acta Mater. 174, 29 (2019).CrossRefGoogle Scholar
Mughrabi, H., Höppel, H.W., and Kautz, M.: Fatigue and microstructure of ultrafine-grained metals produced by severe plastic deformation. Scr. Mater. 51, 807 (2004).CrossRefGoogle Scholar
Furnish, T.A., Mehta, A., Van Campen, D., Bufford, D.C., Hattar, K., and Boyce, B.L.: The onset and evolution of fatigue-induced abnormal grain growth in nanocrystalline Ni–Fe. J. Mater. Sci. 52, 46 (2016).CrossRefGoogle Scholar
Jing, L.J., Pan, Q.S., Long, J.Z., Tao, N.R., and Lu, L.: Effect of volume fraction of gradient nanograined layer on high-cycle fatigue behavior of Cu. Scr. Mater. 161, 74 (2019).CrossRefGoogle Scholar
Meyers, M.A. and Chawla, K.K.: Mechanical Behavior of Materials (Cambridge University Press, New York, 2009).Google Scholar
Suresh, S.: Fatigue of Materials, 2nd ed. (Cambridge University Press, New York, 1998).CrossRefGoogle Scholar
Zhu, Y.T., Liao, X.Z., and Wu, X.L.: Deformation twinning in nanocrystalline materials. Prog. Mater. Sci. 57, 1 (2012).CrossRefGoogle Scholar
Cahn, J.W., Mishin, Y., and Suzuki, A.: Coupling grain boundary motion to shear deformation. Acta Mater. 54, 4953 (2006).CrossRefGoogle Scholar
Legros, M., Gianola, D.S., and Hemker, K.J.: In situ TEM observations of fast grain-boundary motion in stressed nanocrystalline aluminum films. Acta Mater. 56, 3380 (2008).CrossRefGoogle Scholar
Margulies, L., Winther, G., and Poulsen, H.F.: In situ measurement of grain rotation during deformation of polycrystals. Science 291, 2392 (2001).CrossRefGoogle ScholarPubMed
Wierzbanowski, K., Wronski, M., Baczmanski, A., Bacroix, B., Lipinski, P., and Lodini, A.: Problem of lattice rotation due to plastic deformation. Example of rolling of F.C.C materials. Arch. Metall. Mater. 56, 575 (2011).CrossRefGoogle Scholar
Zhang, G.P., Volkert, C.A., Schwaiger, R., Wellner, P., Arzt, E., and Kraft, O.: Length-scale-controlled fatigue mechanisms in thin copper films. Acta Mater. 54, 3127 (2006).CrossRefGoogle Scholar
Hommel, M. and Kraft, O.: Deformation behavior of thin copper films on deformable substrates. Acta Mater. 49, 3935 (2001).CrossRefGoogle Scholar
Lacour, S.P., Wagner, S., Huang, Z., and Suo, Z.: Stretchable gold conductors on elastomeric substrates. Appl. Phys. Lett. 82, 2404 (2003).CrossRefGoogle Scholar
Meyers, M.A., Mishra, A., and Benson, D.J.: Mechanical properties of nanocrystalline materials. Prog. Mater. Sci. 51, 427 (2006).CrossRefGoogle Scholar
Poulsen, H.F., Margulies, L., Schmidt, S., and Winther, G.: Lattice rotations of individual bulk grains—Part I: 3D X-ray characterization. Acta Mater. 51, 3821 (2003).CrossRefGoogle Scholar
Mompiou, F. and Legros, M.: Quantitative grain growth and rotation probed by in situ TEM straining and orientation mapping in small grained Al thin films. Scr. Mater. 99, 5 (2015).CrossRefGoogle Scholar
Zhang, P., Zhang, J.Y., Li, J., Liu, G., Wu, K., Wang, Y.Q., and Sun, J.: Microstructural evolution, mechanical properties and deformation mechanisms of nanocrystalline Cu thin films alloyed with Zr. Acta Mater. 76, 221 (2014).CrossRefGoogle Scholar
Wang, D., Volkert, C.A., and Kraft, O.: Effect of length scale on fatigue life and damage formation in thin Cu films. Mater. Sci. Eng., A 493, 267 (2008).CrossRefGoogle Scholar