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Characteristics of tin whiskers formed on sputter-deposited films—an aging study

Published online by Cambridge University Press:  03 March 2011

J.P. Winterstein ,
J.B. LeBret  and
M.G. Norton
J.P. Winterstein
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
J.B. LeBret
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
M.G. Norton
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99164-2920
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Abstract

Tin whiskers formed on sputter-deposited films on Muntz metal substrates have been examined following long-term aging at room temperature. It was found that while the initial annealing conditions determined the original nucleation and growth rates, whisker nucleation and growth was a continuous process and appeared to be occurring throughout the duration of the study. Whisker densities increased for all samples during aging, and samples that initially showed no whiskers during high-temperature annealing had a population density of 2.5 mm−2 after storage for 15 months.

Keywords

MetalScanning electron microscopy (SEM)Filamentary
Type
Rapid Communications
Information
Journal of Materials Research , Volume 19 , Issue 3 , March 2004 , pp. 689 - 692
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1Compton, K.G., Mendizza, A. and Arnold, S.M., Corrosion 7 327 (1951).CrossRefGoogle Scholar
2Arnold, S.M., Proc. Am. Electroplaters Soc. 43 26 (1956).Google Scholar
3Leidheiser, H. Jr.The Corrosion of Copper, Tin, and Their Alloys (Wiley, New York, 1971).Google Scholar
4Britton, S.C., Transactions of the Institute of Metal Finishing 52 95 (1974).CrossRefGoogle Scholar
5Galyon, G.T.Annotated Tin Whisker Bibliography (National Electronics Manufacturing Initiative, Inc., Herndon, Virginia, 2003).Google Scholar
6Schetty, R., Circuit World 27 17 (2001).CrossRefGoogle Scholar
7LeBret, J.B. and Norton, M.G., J. Mater. Res. 18 585 (2003).CrossRefGoogle Scholar
8Thornton, J.A. and Hoffman, D.W., Thin Solid Films 171 5 (1989).CrossRefGoogle Scholar
9Fisher, R.M., Darken, L.S. and Carroll, K.G., Acta Metall. 2 368 (1954).CrossRefGoogle Scholar
10Dunn, B.D.A Laboratory Study of Tin Whisker Growth European Space Agency Report STR-223 European Space Agency, Paris, France, (1987).Google Scholar
11Pitt, C.H. and Henning, R.G., J. Appl. Phys. 35 459 (1964).CrossRefGoogle Scholar
12Lee, B.Z. and Lee, D.N., Acta Metall. 46 3701 (1998).Google Scholar
13Tu, K.N., Phys. Rev. B 49 2030 (1994).CrossRefGoogle Scholar