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Analysis of Phase Transformation Kinetics by Intrinsic Stress Evolutions During the Isothermal Aging of Amorphous Ni(P) and Sn/Ni(P) Films

Published online by Cambridge University Press:  03 March 2011

J.Y. Song ,
Jin Yu  and
T.Y. Lee
J.Y. Song
Affiliation:
Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology 373-1 Guseong-dong, Yuseong-gu, Daejeon 305-701, Korea
Jin Yu*
Affiliation:
Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology 373-1 Guseong-dong, Yuseong-gu, Daejeon 305-701, Korea
T.Y. Lee
Affiliation:
Department of Materials Engineering, Hanbat National University, San 16-1 Dukmyung-dong, Yuseong-gu, Daejeon 305-719, Korea
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The kinetics for the crystallization of amorphous Ni(P) films and the formation of intermetallic compounds in Sn/Ni(P) films during isothermal aging treatment were studied with in situ intrinsic stress measurements. The intrinsic stress changes from crystallization were about 200 and 150 MPa for Ni(14P) and Ni(11.7P) films, respectively, and according to Johnson–Mehl–Avrami analysis, the Avrami exponents were about 3.6 ± 0.46 and 4.2 ± 0.39, and the activation energies were 242 and240 kJ/mol, respectively, for the crystallization of Ni(14P) and Ni(11.7P) films. The stress due to the formation of intermetallic compounds such as Ni3Sn4 and Ni3P in Sn/Ni(11.7P) films was about 320 MPa. Application of in situ stress measurementsto the empirical growth model during isothermal phase transformation of Sn/Ni(P) showed that the intermetallic compounds growth was interface reaction-controlled (n = 0.91 ± 0.08) in the early stage and then became diffusion-controlled (n =0.38 ± 0.01), and the activation energy was about 35.9 kJ/mol.

Keywords

Phase transformation kineticsIntrinsic stressDiffusion
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 4 , April 2004 , pp. 1257 - 1264
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1Brenner, A. and Riddell, G.: J. Res. Natl. Bur. Stand. 37, 1 (1946).CrossRefGoogle Scholar
2III, G.S. Cargill: J. Appl. Phys. 41, 12 (1970).Google Scholar
3Lu, K., Lück, R. and Predel, B.: Acta Metall. Mater. 42, 2303 (1994).CrossRefGoogle Scholar
4Bagley, B.G. and Turnbull, D.: Acta Matall. 18, 857 (1970).CrossRefGoogle Scholar
5Vafaei-Makhsoos, E., Thomas, E.L. and Toth, L.E.: Metall. Trans. 9A, 1449 (1978).CrossRefGoogle Scholar
6Park, S.H. and Lee, D.Y.: J. Mater. Sci. 23, 1643 (1988).CrossRefGoogle Scholar
7Kumar, P.S. and Nair, P.K.: J. Mater. Proc. Technol. 56, 511 (1996).CrossRefGoogle Scholar
8Keong, K.G., Sha, W. and Malinov, S.: J. Alloys Comp. 334, 192 (2002).CrossRefGoogle Scholar
9Keong, K.G., Sha, W. and Malinov, S.: J. Mater. Sci. 37, 4445 (2002).CrossRefGoogle Scholar
10Hentschel, Th., Isheim, D., Kirchheim, R., Müller, F. and Kreye, H.: Acta Mater. 48, 933 (2000).CrossRefGoogle Scholar
11Buaud, P.P., d’Heurle, F.M., Irene, E.A., Patnaik, B.K. and Parikh, N.R.: J. Vac. Sci. Technol. B9, 2536 (1991).CrossRefGoogle Scholar
12Loopstra, O.B., van Snek, E.R., de Keijser, Th.H. and Mittemeijer, E.J.: Phys. Rev. B. 44, 13519 (1991).CrossRefGoogle Scholar
13Jongste, J.F., Alkemade, P.F.A., Janssen, G.C.A.M. and Radelaar, S.: J. Appl. Phys. 74, 3869 (1993).CrossRefGoogle Scholar
14Lucadamo, G. and Barmak, K.: Thin Solid Films. 389, 8 (2001).CrossRefGoogle Scholar
15Brückner, W., Pitschke, W., Thomas, J. and Leitner, G.: J. Appl. Phys. 87, 2219 (2000).CrossRefGoogle Scholar
16Hesemann, H.Th., Müllner, P. and Arzt, E.: Scripta Mater. 44, 25 (2001).CrossRefGoogle Scholar
17Song, J.Y. and Jin, Yu.: Thin Solid Films. 415, 167 (2002).CrossRefGoogle Scholar
18Zhang, S-L. and d’Heurle, F.M.: Thin Solid Films. 213, 34 (1992).CrossRefGoogle Scholar
19 Solder Joint Reliability, edited by Lau, J.H. (Van Nostrand Reinhold. NewYork, 1989)Google Scholar
20Frederikse, H.P.R., Fields, R.J. and Feldman, A.: J. Appl. Phys. 72, 2879 (1992).CrossRefGoogle Scholar
21Gur, D. and Bamberger, M.: Acta Mater. 46, 4917 (1998).CrossRefGoogle Scholar
22Kang, S.K. and Ramachandran, V.: Scripta Metall. 14, 421 (1980).CrossRefGoogle Scholar
23Jang, J.W., Frear, D.R., Lee, T.Y. and Tu, K.N.: J. Appl. Phys. 88, 6359 (2000).CrossRefGoogle Scholar
24Lee, C-Y. and Lin, K.L.: Thin Solid Films. 249, 201 (1994).CrossRefGoogle Scholar
25Jang, J.W., Kim, P.G., Tu, K.N., Frear, D.R. and Thompson, P.: J. Appl. Phys. 85, 8456 (1999).CrossRefGoogle Scholar
26Stoney, G.G.: Proc. R. Soc. Lond. Ser. A82, 172 (1909).Google Scholar
27Floro, J.A., Hearne, S.J., Hunter, J.A., Kotula, P., Chason, E., Seel, S.C. and Thompson, C.V.: J. Appl. Phys. 89, 4886 (2001).CrossRefGoogle Scholar
28Christian, J.W.: The Theory of Transformation in Metals and Alloys (Pergamon, Oxford, U.K., 1975)Google Scholar
29 Mechanics Solder A State of the Art Assessment, edited by Frear, D.R., Jones, W.B., and Kinsman, K.R. (TMS, Warrendale, PA, 1990), Chap. 2.Google Scholar