Hostname: page-component-78c5997874-94fs2 Total loading time: 0 Render date: 2024-11-20T02:38:47.219Z Has data issue: false hasContentIssue false
  • English
  • Français

An investigation of hardness and adhesion of sputter-deposited aluminum on silicon by utilizing a continuous indentation test

Published online by Cambridge University Press:  31 January 2011

D. Stone ,
W. R. LaFontaine ,
P. Alexopoulos ,
T. -W. Wu  and
Che-Yu Li
D. Stone
Affiliation:
Cornell University, Ithaca, New York 14853
W. R. LaFontaine
Affiliation:
Cornell University, Ithaca, New York 14853
P. Alexopoulos
Affiliation:
IBM Almaden Research Center, San Jose, California 95192
T. -W. Wu
Affiliation:
IBM Almaden Research Center, San Jose, California 95192
Che-Yu Li
Affiliation:
Cornell University, Ithaca, New York 14853
Get access

Abstract

The hardness of aluminum films on silicon are measured as functions of depth of the indenter. The films have thicknesses of 0.25,0.5, and 1.0μm. The adhesion between one film and the substrate has been reduced through the prior deposition of a 10 nm layer of carbon. In each case the hardness is found to increase as the indenter approaches the film-substrate interface, but the rate of increase is greater for a film with good adhesion than for one with poor adhesion. It is suggested that this increase results from the constraint on deformation of the film by the substrate. A physical model is proposed whereby the yield stress of the film, σo, and an average effective shear strength τ of the indenter-film and film-substrate interfaces, may be determined from the data.

Type
Articles
Information
Journal of Materials Research , Volume 3 , Issue 1 , February 1988 , pp. 141 - 147
Copyright
Copyright © Materials Research Society 1988

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Loubet, J. L.Georges, J. M. and Meille, G. in ASTM STP 889, edited by Blau, P. J. and Lawn, B. (American Society for Testing and Materials, Philadelphia, PA, 1986), pp. 72–89.Google Scholar
2Pethica, J.B.Hutchings, R. and Oliver, W.C.Philos. Mag. A48, 593 (1983).Google Scholar
3Engel, P.A. and Roshon, D.D.J. Adhes. 10, 237 (1979).CrossRefGoogle Scholar
4Tazaki, M.Nishibori, M. and Kinosita, K.Thin Solid Films 51, 13 (1978).Google Scholar
5Pollock, H. M.Maugis, D. and Barquins, M. in Ref. 1, pp. 47–71.Google Scholar
6Lebouvier, D.Gilormini, P. and Felder, E.J. Phys. D18, 199 (1985).Google Scholar
7Hannula, S.P.Stone, D. and Li, C.Y.Mater. Res. Soc. Symp. Proc. 40, 217 (1985).Google Scholar
8Stone, D.LaFontaine, W.Ruoff, S.Hannula, S.P.Yost, B. and Li, CheYu, Mater. Res. Soc. Symp. Proc. 72, 127 (1986).Google Scholar
9Doerner, M. F. and Nix, W. D.J. Mater. Res. 1, 601 (1986).Google Scholar
1OMarshall, D. B. and Lawn, B. R. in Ref. 1, pp. 26–46.Google Scholar
11Mott, B. W.Microindentation Hardness Testing (Butterworths, London, 1957).Google Scholar
12Dieter, G. E.Mechanized Metallurgy (McGraw-Hill, New York, 1976), 2nd ed., p. 565.Google Scholar
13Hall, E. O.Proc. Phys. Soc. London B643, 747 (1961); N.J. Petch J. Iron Steel Inst. 174, 25 (1953).Google Scholar
14Doerner, M. F.Gardner, D. S. and Nix, W. D.J. Mater. Res. 1, 845 (1986).Google Scholar