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Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

Published online by Cambridge University Press:  31 January 2011

Donald W. Henderson ,
Timothy Gosselin ,
Amit Sarkhel ,
Sung K. Kang ,
Won-Kyoung Choi ,
Da-Yuan Shih ,
Charles Goldsmith  and
Karl J. Puttlitz
Donald W. Henderson*
Affiliation:
IBM Corporation, 1701 North St., Endicott, New York 13760
Timothy Gosselin
Affiliation:
IBM Corporation, 1701 North St., Endicott, New York 13760
Amit Sarkhel
Affiliation:
IBM Corporation, 1701 North St., Endicott, New York 13760
Sung K. Kang*
Affiliation:
IBM Corporation, T.J. Watson Research Center, Yorktown Heights, New York 10598
Won-Kyoung Choi
Affiliation:
IBM Corporation, T.J. Watson Research Center, Yorktown Heights, New York 10598
Da-Yuan Shih
Affiliation:
IBM Corporation, T.J. Watson Research Center, Yorktown Heights, New York 10598
Charles Goldsmith
Affiliation:
IBM Corporation, Hopewell Junction, New York 12533
Karl J. Puttlitz
Affiliation:
IBM Corporation, Hopewell Junction, New York 12533
*
a) Address all correspondence to these authors.
a) Address all correspondence to these authors.
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Abstract

Near-ternary eutectic Sn–Ag–Cu alloys are leading candidates for Pb-free solders. These alloys have three solid phases: β–Sn, Ag3Sn, and Cu6Sn5. Starting from the fully liquid state in solidifying near-eutectic Sn–Ag–Cu alloys, the equilibrium eutectic transformation is kinetically inhibited. The Ag3Sn phase nucleates with minimal undercooling, but the β–Sn phase requires a typical undercooling of 15 to 30 °C for nucleation. Because of this disparity in the required undercooling for nucleation, large, platelike Ag3Sn structures can grow rapidly within the liquid phase, before the final solidification of the solder joints. At lower cooling rates, the large Ag3Sn plates can subtend the entire cross section of solder joints and can significantly influence the mechanical deformation behavior of the solder joints under thermomechanical fatigue conditions. In this paper, it is demonstrated that the Ag3Sn plate formation can be inhibited, an important factor in assuring the reliability of solder joints composed of these alloys.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 17 , Issue 11 , November 2002 , pp. 2775 - 2778
Copyright
Copyright © Materials Research Society 2002

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References

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