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Disruptive bubble behaviour leading to microstructure damage in an ultrasonic field

Published online by Cambridge University Press:  09 June 2014

Tae-Hong Kim  and
Ho-Young Kim
Tae-Hong Kim
Affiliation:
Department of Mechanical and Aerospace Engineering, Seoul National University, Seoul 151-744, Korea
Ho-Young Kim*
Affiliation:
Department of Mechanical and Aerospace Engineering, Seoul National University, Seoul 151-744, Korea
*
†Email address for correspondence: [email protected]
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Abstract

Bubble oscillations play a crucial role in ultrasonic cleaning, a process by which micro- and nanoscale contaminant particles are removed from solid surfaces, such as semiconductor wafers, photomasks and membranes. Although it is well known that the ultrasonic cleaning may damage the functional patterns of ever-shrinking size in current manufacturing technology while removing dust and debris, the mechanisms leading to such damage have been elusive. Here we report observations of the dynamics of bubbles that yield microstructure damage under a continuous ultrasonic field via high-speed imaging. We find that the bubble behaviour can be classified into four types, namely volume oscillation, shape oscillation, splitting and chaotic oscillation, depending on the acoustic pressure and bubble size. This allows us to construct a regime map that can predict the bubble behaviour near a wall based on the experimental parameters. Our visualization experiments reveal that damage of microwalls and microcantilevers arises due to either splitting small bubbles or chaotically oscillating large bubbles in the ultrasonic field, with the forces generated by them quantitatively measured.

JFM classification

Drops and Bubbles: Bubble dynamics Drops and Bubbles: Cavitation Drops and Bubbles: Drops and Bubbles
Type
Papers
Information
Journal of Fluid Mechanics , Volume 750 , 10 July 2014 , pp. 355 - 371
Copyright
© 2014 Cambridge University Press 

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