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Power performance of 65 nm CMOS integrated LDMOS transistors at WLAN and X-band frequencies

Published online by Cambridge University Press:  09 January 2015

Sara Lotfi
Affiliation:
The Ångström Laboratory, Solid State Electronics, Uppsala University, P.O. Box 534, SE-75121Uppsala, Sweden. Phone: +46-18-471-3035
Olof Bengtsson
Affiliation:
Ferdinand-Braun-Institut (FBH), Leibniz-Institut für Höchstfrequenztechnik, Gustav-Kirchhoff-Strasse 4, D-12489Berlin, Germany
Jörgen Olsson*
Affiliation:
The Ångström Laboratory, Solid State Electronics, Uppsala University, P.O. Box 534, SE-75121Uppsala, Sweden. Phone: +46-18-471-3035
*
Corresponding author: J. Olsson Email: [email protected]

Abstract

Laterally diffused metal oxide semiconductor (LDMOS) transistors with 10 V breakdown voltage have been implemented in a 65 nm Complementary metal oxide semiconductor (CMOS) process without extra masks or process steps. Radio frequency (RF) performance for Wireless local area network (WLAN) frequencies and in X-band at 8 GHz is investigated by load-pull measurements in class AB operation for both 3.3 and 5 V supply voltage. Results at 2.45 GHz showed 290 mW/mm output power density with 17 dB linear gain and over 45% power added efficiency (PAE) at 4 dB compression at a supply voltage of 5 V. Furthermore, results in X-band at 8 GHz show 8 dB linear gain, 320 mW/mm output power density and over 22% PAE at 4 dB compression. Third-order intermodulation measurements at 8 GHz revealed OIP3 of 18.9 and 21.9 dBm at 3.3 and 5 V, respectively. The transistors were also tested for reliability which showed no drift in quiescent current after 26 h of DC stress while high-power RF stress showed only small extrapolated drift at 10 years in output power density. This is to the authors' knowledge the first time high output power density in X-band is demonstrated for integrated LDMOS transistors manufactured in a 65 nm CMOS process without extra process steps.

Type
Research Paper
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2015 

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References

REFERENCES

[1]Abidi, A.A.: RF CMOS comes of age. IEEE J. Solid-State Circuits, 39 (2004), 549561.Google Scholar
[2]Bianchi, R.A.; Monsieur, F.; Blanchet, F.; Raynaud, C.; Noblanc, O.: High voltage devices integration into advanced CMOS technologies. IEEE Int. Electron Devices Meeting, 2008, 14.Google Scholar
[3]Mohapatra, N.R. et al. : A complementary RF-LDMOS architecture compatible with 0.13 µm CMOS technology. IEEE Int. Symp. on Power Semiconductor Devices and IC's, 2006, 14.Google Scholar
[4]Gruner, D.; Sorge, R.; Bengtsson, O.; Al Tanany, A.; Boeck, G.: Analysis, design, and evaluation of LDMOS FETs for RF power applications up to 6 GHz. IEEE Trans. Microw. Theory Tech., 58 (2010), 40224030.Google Scholar
[5]Tao, Y.; Huailin, L.; Yong Zhong, X.; Rong, Z.; Jinglin, S.; Ru, H.: Cost-effective integrated RF power transistor in 0.18-μm CMOS technology. IEEE Electron Device Lett., 27 (2006), 856858.Google Scholar
[6]Calvillo-Cortes, D.A. et al. : A 65 nm CMOS pulse-width-controlled driver with 8Vpp output voltage for switch-mode RF PAs up to 3.6 GHz. IEEE Int. Solid-State Circuits Conf. Digest of Technical Papers (ISSCC), 2011, 5860.CrossRefGoogle Scholar
[7]Johansson, T. et al. : A +32.8 dBm LDMOS power amplifier for WLAN in 65 nm CMOS technology. European Microwave Integrated Circuits Conf., Nuremberg, 2013, 5356.Google Scholar
[8]Sorge, R. et al. : Integrated Si-LDMOS transistors for 11 GHz X-Band power amplifier applications. IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2010, 9093.Google Scholar
[9]Muller, D. et al. : High-performance 15-V novel LDMOS transistor architecture in a 0.25-μm BiCMOS process for RF-power applications. IEEE Trans. Electron. Devices, 54 (2007), 861868.CrossRefGoogle Scholar
[10]Lotfi, S.; Olsson, J.: Investigating reliability and stress mechanisms of DC stressed CMOS 65 nm RF-LDMOS by full gate current characterization. IEEE Trans. Device Mater. Reliab., under review (2014).Google Scholar
[11]Olsson, J.: Self-heating effects in SOI bipolar transistors. Microelectron. Eng., 56 (2001), 339352.Google Scholar