Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-22T07:05:30.384Z Has data issue: false hasContentIssue false

Modular Ka-band switch matrices using two RF MEMS technologies

Published online by Cambridge University Press:  03 April 2013

Sascha A. Figur*
Affiliation:
EADS Innovation Works, Munich, Germany. Phone: +49 89 60729054
Erika Meniconi
Affiliation:
EADS Innovation Works, Munich, Germany. Phone: +49 89 60729054
Ulrich Prechtel
Affiliation:
EADS Innovation Works, Munich, Germany. Phone: +49 89 60729054
Volker Ziegler
Affiliation:
EADS Innovation Works, Munich, Germany. Phone: +49 89 60729054
Roberto Sorrentino
Affiliation:
University of Perugia, DIEI, Perugia, Italy
Larissa Vietzorreck
Affiliation:
Technische Universitaet Muenchen, Lehrstuhl fuer Hochfrequenztechnik, Munich, Germany
Bernhard Schoenlinner
Affiliation:
EADS Innovation Works, Munich, Germany. Phone: +49 89 60729054
*
Corresponding author: S.A. Figur Email: [email protected]

Abstract

This paper presents the design and measurement of two different switch matrix modules based on Radio Frequency Microelectromechanical System (RF MEMS) switches. The operational frequency range is between 25.5 GHz and 26.5 GHz for data links between a Geostationary Earth Orbit (GEO) relay satellite and Low Earth Orbit (LEO) satellites. The switch matrix implements a key functionality for tracking the incident signals of the LEO satellites on the receive feed antenna array of the GEO satellite's reflector antenna. Two different technologies are used to build simplified switch matrix modules suitable for realizing the full functionality switching matrix. Rogers RT/Duroid 5880 with commercially available RF MEMS is used to build the first module, while EADS in house RF MEMS are integrated in Rogers Ultralam 3850 Liquid Crystal Polymer (LCP) for the second module. Maximum insertion losses of 8.5 dB and 10.2 dB have been measured for the Rogers RT/Duroid 5880 and the LCP module, respectively. Isolation is higher than 45 dB and a minimum return loss of 15 dB is shown. Finally, the measured losses in the LCP module are analyzed and suitable improvements are discussed.

Type
Industrial and Engineering Paper
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2013 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1]Greda, L. et al. A satellite multibeam antenna for high-rate data relays, in ESA ESTEC – 32nd ESA Antenna Workshop on Antennas for Space Applications, Noordwijk, Niederlande, 2010, 15.Google Scholar
[2]Siegel, C.; Ziegler, V.; Schoenlinner, B.; Prechtel, U.; Schumacher, H.: Simplified RF-MEMS switches using implanted conductors and thermal oxide, in 36th European Microwave Conf., Manchester, UK, 2006, 17351738.Google Scholar
[3]Greda, L.A.; Knuepfer, B.; Knogl, J.S.; Heckler, M.V.T.; Bischl, H.; Dreher, A.: A multibeam antenna for data relays for the German communications satellite Heinrich-Hertz, in Fourth European Conf. on Antennas and Propagation (EuCAP), Barcelona, Spain, 2010, 14.Google Scholar
[4]Figur, S.A.; Schoenlinner, B.; Prechtel, U.; Vietzorreck, L.; Ziegler, V.: Simplified 16 × 8 RF MEMS switch matrix for a GEO-stationary data relay, in German Microwave Conf. 2012, Illmenau, Germany, 2012, 14.Google Scholar
[5]Inayat, I.: Hybrid integration of RF MEMS switches with LTCC substrate for the design of 8 × 16 switch matrix, Master's thesis, Technische Universitaet Muenchen, Munich, Germany, 2009, 1152Google Scholar
[6]Meniconi, E.; Schoenlinner, B.; Prechtel, U.; Hartmann, J.; Sorrentino, R.; Ziegler, V.: Broadband RF-MEMS based switching network for automated measurements of multifeed antennas, in European Microwave Integrated Circuits Conf. (EuMIC) 2011, Manchester, UK, 2011, 676679.Google Scholar
[7]Kingsley, N.: Liquid crystal polymer: enabling next-generation conformal and multilayer electronics, Microw. J. 5 2008, 188200.Google Scholar
[8]Haubold, M.; Figur, S.; Schoenlinner, B.; Kurth, S.; Gessner, T.: Low temperature wafer bonding technology for RF based MEMS devices, in Smart Systems Integration 2013, Amsterdam, Netherlands, 2013.Google Scholar