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Millimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches

Published online by Cambridge University Press:  18 March 2011

Christophe Calvez ,
Romain Pilard ,
Christian Person ,
Jean-Philippe Coupez ,
François Gallée ,
Frédéric Gianesello ,
Hilal Ezzeddine  and
Daniel Gloria
Christophe Calvez*
Affiliation:
Lab-STICC/MOM, Telecom Bretagne, Technopôle Brest-Iroise, CS 83818, 29238 Brest Cedex, France. Phone:  + 33 2 29 14 39.
Romain Pilard*
Affiliation:
STMicroelectronics – 850, rue Jean Monnet, 38926 Crolles, France. Phone:  + 33 4 38 92 37 68.
Christian Person
Affiliation:
Lab-STICC/MOM, Telecom Bretagne, Technopôle Brest-Iroise, CS 83818, 29238 Brest Cedex, France. Phone:  + 33 2 29 14 39.
Jean-Philippe Coupez
Affiliation:
Lab-STICC/MOM, Telecom Bretagne, Technopôle Brest-Iroise, CS 83818, 29238 Brest Cedex, France. Phone:  + 33 2 29 14 39.
François Gallée
Affiliation:
Lab-STICC/MOM, Telecom Bretagne, Technopôle Brest-Iroise, CS 83818, 29238 Brest Cedex, France. Phone:  + 33 2 29 14 39.
Frédéric Gianesello
Affiliation:
STMicroelectronics – 850, rue Jean Monnet, 38926 Crolles, France. Phone:  + 33 4 38 92 37 68.
Hilal Ezzeddine
Affiliation:
STMicroelectronics – 16, rue Pierre et Marie Curie, 37100 Tours, France.
Daniel Gloria
Affiliation:
STMicroelectronics – 850, rue Jean Monnet, 38926 Crolles, France. Phone:  + 33 4 38 92 37 68.
*
Corresponding authors: C. Calvez and R. Pilard Emails: [email protected], [email protected]
Corresponding authors: C. Calvez and R. Pilard Emails: [email protected], [email protected]
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Abstract

Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave (mmWave) applications and their characterization are presented in this paper. Antenna integration on low resistivity (LR) and high resistivity (HR) silicon substrate are expected. And, in a packaging approach, the combination of antenna on silicon with a material, which has the effect of a “lens”, allowing increasing gain is presented. In a second part, to satisfy beamforming capabilities, a hybrid integration of the antenna on silicon and glass substrates is proposed.

Keywords

Antenna DesignModelling and MeasurementsAntennas and Propagation for Wireless Systems
Type
Research Article
Information
International Journal of Microwave and Wireless Technologies , Volume 3 , Special Issue 2: 60 GHz Wireless Communication Circuits and Systems , April 2011 , pp. 179 - 188
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2011

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References

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